Search results for "Infineon"

To address the specific requirements of cost-effective applications, Infineon Technologies has released bipolar power modules in solder bond technology. The PowerBlock modules expand the company’s power module portfolio which, thus far, was only using pressure contacts. Infineon offers optimised solutions for different applications like industrial drives, renewable energy, soft starters, UPS systems, welding and static switches driven by co...

The TO-247PLUS package has been introduced by Infineon Technologies, expanding its discrete IGBT portfolio for high power applications. The package, which has the same footprint and pin-out as JEDEC standard TO-247-3, enables up to 120A IGBT co-packed with a full rated diode.

To address thegrowing trend towards intelligent motor control, Infineon Technologies has introduced the ARM-based Embedded Power family of bridge drivers at electronica 2014. Claimed to be an industry first, the drivers feature a high-performance MCU powered by the ARM Cortex-M3 processor, NVM, analogue and mixed signal peripherals, communication interfaces and MOSFET gate drivers.

The Boosted NFC Secure Element from Infineon Technologies is being supplied to Watchdata Technologies for it’s Sharkey smart wearable devices. These devices, which are available as smart watches or wristbands, enable a mobile lifestyle, operating as secure bank cards when shopping or contactless tickets when taking public transportation combined with personal sport management functions.

Addressing the need for increased power density and space saving in applications requiring high efficiency, Infineon Technologies has released a variant of the TO-247 package. The TO-247 4 Kelvin-Sense package provides efficiency levels previously unavailable when used together with the company’s TRENCHSTOP 5 IGBT and Rapid diode technologies.

CIPURSE-compliant security chips for contactless transport ticketing, micro-payment, authentication and access solutions are now supplied by Infineon Technologies. Now offering CIPURSE4move, CIPURSEmove and CIPURSESAM, the company claims to be the world’s first supplier of a complete CIPURSE portfolio.

Designed for official documents, the Dual InterfaceCoM (Coil on Module) package technology has been released by Infineon Technologies. The manufacture of Dual Interface electronic identification cards, electronic drivers’ licenses or health insurance cards is simplified by the technology.

RESCAR 2.0 (Robuster Entwurf von neuen Elektronikkomponenten für Anwendungen im Bereich Elektromobilität - Robust design of new electronic components for applications in electromobility), a collaborative research project which includes Audi, Bosch, Elmos Semiconductor, FZI and Infineon, has improved the reliability and robustness of electronic systems for EVs, and made ECUs of the future four times more durable.

The latest version of IAR Embedded Workbench for 8051 includes high-performance compiler and debugger tools with extensive support for a wide range of MCUs from vendors such as Atmel, Intel, Infineon, NXP, Silicon Labs and Texas Instruments. Version 9.10 of the development toolchain includes further tweaked code optimisations, new debugging functionality and added core support.

Reliable and precise sensing of the Electric Power Steering (EPS) torque in an electric power steering system has previously always required two sensors to function.Thanks to Infineon's dual-sensor package innovation, only one sensor chip is likely to be required in future.