Search results for "SEMI"
Conference highlights Asia's semiconductor industry growth
Following the success of its inaugural edition, the second Electronics Asia Conference (EAC), a virtual conference and exhibition organised byAspenCore, the publisher of EE Times Asia, EE Times India, and EDN Asia, is set to take place from October 17 to 19, 2023.
Avnet Embedded launches solder-on OSM Size-S modules
Avnet Embedded presents the compact MSC OSM-SF-IMX93 OSM computing modules compliant with the new OSM 1.1 standard (Size-S) ‘Small’ with dimensions of 30 x 30mm.
NXP’s S32K3 automotive MCUs with AWS cloud services
S32K3-based zonal aggregators and end nodes can now access cloud services, further expanding cloud access across the S32 vehicle compute platform. New S32K3 capability provides automakers flexible cloud connectivity for new vehicle architectures.
Stepper motor drivers come in two variants
EAO has introduced two new stepper motor drive families with the ability to deliver the higher torque factors necessary to make motion smoother and more precise and slash equipment positioning cycle times.
Avnet Abacus, XP Power agree EMEA pact
Avnet Abacus has signed an EMEA-wide distribution agreement with XP Power, a provider of safe, reliable and efficient power solutions.
Danfoss Power Solutions to showcase tech for future of farming at Agritechnica 2023
Danfoss Power Solutions plans to exhibit products and solutions that lead the way to more sustainable farming at Agritechnica 2023, November 12-18, in Hanover, Germany. From autonomy and electrification to productivity and safety, attendees will discover the company's system solution capabilities through the trends and issues important to modern agriculture.
OSM computing modules cut connector, cuts costs
The compact MSC OSM-SF-IMX93 OSM computing modules from Avnet Embedded are compliant with the new OSM 1.1 standard(Size-S) “Small” with dimensions of 30 x 30mm.
ULVAC-PHI launches sales of latest TOF-SIMS instrument 'PHI nanoTOF 3+'
ULVAC-PHI announce the launch of the PHI nanoTOF 3+. This new product release comes two years after its predecessor, the PHI nanoTOF 3. The new model builds upon the foundation of the PHI nanoTOF 3 and introduces the following three new features.
Semidynamics and SignatureIP create fully tested RISC-V multi-core environment and CHI interconnect
There is an ever-increasing demand for more powerful chip designs for advanced applications, such as AI and ML, that require many cores on one chip. To facilitate this, Semidynamics and SignatureIP have partnered to integrate their respective IPs to provide a fully-tested RISC-V, multi-core environment and CHI interconnect for the development of state-of-the-art chip designs.
Advantest wins 2022 best supplier award from ASE Holdings
Leading semiconductor test equipment supplier Advantest Corporation announced it has received a 2022 Best Supplier Award from longtime partner ASE Technology Holding. at ASE Holdings' annual Supplier Day. Advantest participated in this event, held August 18th at the Taipei Grand Hyatt Hotel in Taiwan, alongside 400 attendees representing 100 suppliers that work with ASE Holdings and its subsidiaries.