Search results for "soldering"
Embedded active optical system allows direct-soldered connection
Hirose Electric have developed and released the BF4 series. The product is a small, space saving embedded Active Optical system, which allows for a connector to be soldered onto the PCB, then the optical device with built in E/O and O/E converters to be plugged onto the board.
High-speed 940nm IR emitters reduce component count
Built on the company's SurfLight surface emitter chip technology, a high-speed 940nm IR emitter has been announced by Vishay Intertechnology. The devices are claimed to provide up to five times greater radiant intensity than standard IR emitters, reducing component counts, improving performance and lowering solution costs in a wide range of IR illumination, data transmission and gesture recognition applications.
Pulse resistant fuses designed for automated assembly
A range of pulse resistant fuses and matching holders have been introduced by SCHURTER. The range is comprised of the UMF 250, UMT 250, UMZ 250, UMK 250, UMT-H. The matching fuse holders are glow wire resistant and suitable for reflow soldering.
Ultra-low capacitance ESD protection diode saves board space
Vishay has released a Bidirectional Symmetrical (BiSy) single-line ESD protection diode for portable electronics in the ultra-compact CLP0603 package. Measuring only 0.6x0.3x0.27mm, the VBUS05B1-SD0 offers ultra-low capacitance and leakage current for the protection of high-speed data lines and antennas against transient voltage signals.
Workshops on PCB manufacturing processes to be held
Nordson ASYMTEK has announced that it will partner with Kintner Equipment to conduct workshops on PCB manufacturing processes from 21st to 23rd April 2015, at the Kintner facility in New York. The free workshop is designed to present to manufacturing, process and quality engineers, ways to identify and resolve process-related issues, eliminate production bottlenecks and optimise production-line yields to improve profitability.
Seica to demonstrate testing & soldering systems at event
At APP Technology Day, which takes place from 10th to 12th 2015 at Anglo Production Processes in Saxon Business Park, Seica will demonstrate its Flying Prober Pilot 4DV8 system and FireflyB60 soldering system.
SMARC test adapter allows for 100% contacting reliability
A test adapter for the SMARC CoM standard, which allows for 100% contacting reliability, has been released by Yamaichi Electronics. The adapter utilises spring probe pins, allowing very high contact cycles to be reached.The SMARC test adapter is a performance controlled system according to the Standardization Group for Embedded Technologies SMARC specification.
The power packaging market is growing
According to a recent report published by Yole Développement (Yole), titled: Power Packaging Technologies Trends & Market Expectations, the power packaging market is growing. Between 2014 and 2020, the interconnection and substrate segments are expected to increase by 14% and 13%, respectively. In addition, the global growth for raw material is expected to reach 12% between 2014 and 2020, with a market of $1.7bn by 2020.
Micro SFP+ frees up 19% more faceplate space
A micro SFP+ connector and cable assembly, which reduces space requirements on faceplates and PCBs in telecomms, data communications, networking and medical diagnostic equipment, has been released by TE Connectivity. The connector and cable assembly is up to 50% smaller in width and length than current SFP+ interconnects, enabling denser equipment designs.
Selective fluxing & soldering combined in one system
Manncorp has announced the IS-T-300, an all-in-one selective fluxing and soldering system designed to deliver outstanding quality and consistent, efficient performance. Suitable for double-sided and mixed technology PCBs up to 300x500mm, with an option for 460x700mm boards, the system features laser-controlled wave height compensation, high-precision jet-fluxing and CAD data import.