Search results for "Infineon"

Expanding its CoolMOS family, Infineon Technologies has introduced the CoolMOS C7 Gold 650V in a TO-Leadless package. This combination of improved superjunction semiconductor process and advanced SMD package design is delivering unparallelled performance in hard switching applications. The small footprint of this package brings power density advantages for server, telecomms and solar applications.

Power modules from Infineon for hybrid and electric vehicles (H/EVs) meet challenges presented by CO2 regulations to meet targets of 95g CO2 /km in Europe, 121g/km in the US, 117g/km in China and 105g/km in Japan by 2020.The HybridPack Double Sided Cooling (DSC) power modules for H/EVs measure 42 x 42.4 x 4.77mm.

Infineon Technologies and Würth Elektronik present an easy and affordable entry into digital power control applications. The Digital Power Explorer Kit was developed for analogue power supply designers and embedded software programmers to help them better understand and implement the capabilities of digital power control based on standard MCUs.

Maximising the performance characteristics of SiC, Infineon has announced it is sampling 1,200V SiC MOSFETS. The CoolSiC MOSFETs are available in three- and four- pin package options and improve dynamic loses, especially at high currents.

Infineon has added a number of wide body package options to its EiceDRIVER Compact galvanically isolated gate driver IC family. The 7.62mm (0.3") 1EDI Compact devices are supplied in a DSO-8 package offering increased creepage distances and improved thermal behaviour.

95% of the universe is still considered unexplored. Scientists at CERN, the world’s largest particle physics research centre, are working on solving these mysteries. In May 2012, researchers there discovered the so-called Higgs Boson, whose prediction won Peter Higgs and François Englert the Nobel prize in physics.

Offering a scalable design platform for 3-phase motor drives in the 20 to 300W range, Infineon announces its iMotion Modular Application Design Kit (MADK). The compact and flexible evaluation system includes controller and power boards (optionally with sensors). Using the kit, a full functioning motor system will be running in less than one hour, enabling a faster time-to-market.

Infineon Technologies announces SiC MOSFET technology which allows product designs to achieve previously unattainable levels of power density and performance. Infineon’s CoolSiC MOSFETs offer a new degree of flexibility for increasing efficiency and frequency. They will help developers of power conversion schemes to save space and weight, reduce cooling requirements, improve reliability and lower system costs.

It is now common knowledge throughout the semiconductor industry: MACOM is pursuing legal action against Infineon Technologies. The story is complex yet so predictable: Yole Développement and its sister company KnowMade, both heavily involved in technology, marketing and IP analysis for the semiconductor industry, released a patent landscape analysis report two years ago dedicated to GaN-on-Si technologies.

This year’s PCIM exhibition introduced a whole host of new power products, technologies and applications. Sally Ward-Foxton reports from Nuremberg.This year’s PCIM (power conversion, intelligent motion) exhibition in Nuremberg brought together 436 exhibitors and more than 10,000 visitors from around the world to share the latest in power products, technologies and applications.