Search results for "microelectronics"

Engineered Materials Systems will exhibit in Booth #853 at the upcoming Assembly & Automation Technology Expo, scheduled to take place September 20-22, 2011 at McCormick Place North in Chicago, IL.

The UK Electronic Skills Foundation (UKESF) has reported a 70 per cent increase in industrial support for the second year of its university scholarship programme. It now receives funding from 12 firms to award 51 UKESF Scholarships to elite electronics engineering undergraduate students - up from 30 in 2010. The comprehensive scheme includes bursaries, paid work experience, industrial mentoring and professional development workshops designed to ...

Nordson DAGE announced its new Materials testing capability on the 4000Plus at the Productronica exhibition that was held in Munich, Germany from November 15-18, 2011. Designed to support the materials testing needs of the microelectronics market, from static testing to fatigue, the 4000Plus has the flexibility required to characterize the mechanical properties of individual bonds, devices and circuit boards. The user interface is preconfigured f...

SmartKem Limited, the developer of novel, printable organic semiconductor materials and ink formulations for flexible electronics, today announced it has received investment funding from the Porton Capital Group and Finance Wales Investments Limited. The investment allows SmartKem to further develop its flexible printed electronics solutions.

INSIDE Secure have declared the appointment of Pierre Garnier as executive vice president of the NFC and secure payment division and member of the management board, effective as of August 1, 2012. Mr. Garnier replaces Charles Walton who will be leaving the company later in August to become chief executive officer of Canadian company SecureKey, a partner of INSIDE Secure in the NFC and secure transactions industry.

Inphi Corporation (NYSE: IPHI), a leading provider of high-speed analog semiconductor solutions for the communications and computing markets, today announced that its Isolation Memory Buffer (iMB) 02-GS02A has completed a significant milestone for the component validation phase with Intel. Memory vendors will now be able to use Inphi’s iMB components to build memory modules for DIMM level qualification.

Vector Fabrics announces it has signed a contract with the EUROPRACTICE Software Service for the provision of its cloud-based vfAnalyst tool to European academic institutions and publicly funded research laboratories. Under this agreement, vfAnalyst will be available to over 530 universities and 100 research institutes across 44 countries.

Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.

New Scale has announced today that it has received a U.S. patent for its reduced-voltage miniature piezoelectric motor and drive system, capable of operating directly from battery voltage as low as 2.3 VDC. By eliminating the need for boost circuits, this invention reduces system size and component cost and enables integration into a wide range of battery-driven products to move elements such as optical lenses.

Ultra Electronics, Manufacturing & Card Systems, a leading contract electronics manufacturer operating in the aerospace, security, transport and energy markets, announces that Extec Integrated Systems has now been acquired and integrated into Ultra’s CEMS business. Ultra and Extec share many similar target customers in markets that demand high-reliability products, as well as sharing a focus on compliance to the highest standards of manufacturi...