Search results for "microelectronics"
JEDEC Publishes New Thermal Testing Standard Inspired by Mentor Graphics T3Ster Technology
Mentor Graphics Corporation (NASDAQ: MENT) today announced that JEDEC, the organization dedicated to open standards in the microelectronics industry, has approved a thermal transient testing-based measurement methodology inspired by an original idea published jointly by the Mentor Graphics® MicReD® group and the Automotive Power Application group of Infineon in 2005.
STI Electronics to Feature Key Engineering Services at Space and Missile Defense Conference and Exhibition
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, will feature its key engineering services at the upcoming Space and Missile Defense Conference and Exhibition, scheduled to take place August 15-18, 2011 at the Von Braun Center in Huntsville, AL.
Engineered Materials Systems to Exhibit at the 2011 Assembly & Automation Technology Expo
Engineered Materials Systems will exhibit in Booth #853 at the upcoming Assembly & Automation Technology Expo, scheduled to take place September 20-22, 2011 at McCormick Place North in Chicago, IL.
Industry increases UKESF scholarship support by 70 per cent Strategic Advisory Board calls for more engagement from the electronics systems community
The UK Electronic Skills Foundation (UKESF) has reported a 70 per cent increase in industrial support for the second year of its university scholarship programme. It now receives funding from 12 firms to award 51 UKESF Scholarships to elite electronics engineering undergraduate students - up from 30 in 2010. The comprehensive scheme includes bursaries, paid work experience, industrial mentoring and professional development workshops designed to ...
Nordson DAGE Announces New Materials Test Capability at Productronica 2011
Nordson DAGE announced its new Materials testing capability on the 4000Plus at the Productronica exhibition that was held in Munich, Germany from November 15-18, 2011. Designed to support the materials testing needs of the microelectronics market, from static testing to fatigue, the 4000Plus has the flexibility required to characterize the mechanical properties of individual bonds, devices and circuit boards. The user interface is preconfigured f...
SmartKem Receives Investment Funding To Continue Innovative Development
SmartKem Limited, the developer of novel, printable organic semiconductor materials and ink formulations for flexible electronics, today announced it has received investment funding from the Porton Capital Group and Finance Wales Investments Limited. The investment allows SmartKem to further develop its flexible printed electronics solutions.
Inphi JEDEC-Compliant Memory Buffer Completes Next Level of Intel Validation
Inphi Corporation (NYSE: IPHI), a leading provider of high-speed analog semiconductor solutions for the communications and computing markets, today announced that its Isolation Memory Buffer (iMB) 02-GS02A has completed a significant milestone for the component validation phase with Intel. Memory vendors will now be able to use Inphi’s iMB components to build memory modules for DIMM level qualification.
EUROPRACTICE adds vfAnalyst to academic software service
Vector Fabrics announces it has signed a contract with the EUROPRACTICE Software Service for the provision of its cloud-based vfAnalyst tool to European academic institutions and publicly funded research laboratories. Under this agreement, vfAnalyst will be available to over 530 universities and 100 research institutes across 44 countries.
Finetech Sells 12 Bonding Systems to University Labs to Advance Research
Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.
Ultra Manufacturing & Card Systems acquires Extec hybrid microelectronics team
Ultra Electronics, Manufacturing & Card Systems, a leading contract electronics manufacturer operating in the aerospace, security, transport and energy markets, announces that Extec Integrated Systems has now been acquired and integrated into Ultra’s CEMS business. Ultra and Extec share many similar target customers in markets that demand high-reliability products, as well as sharing a focus on compliance to the highest standards of manufacturi...