Search results for "pico"
Atmel Collaborates with H&D Wireless to Deliver World's Most Power Efficient Embedded Wi-Fi Solution
Atmel today announced it is collaborating with H&D Wireless to deliver an IEEE802.11b+g Wi-Fi solution for Atmel's 32-bit AVR microcontrollers. In this collaboration, H&D Wireless will provide the SPB104 Wi-Fi extension board which is easily connected to the AVR32 UC3 evaluation kits through the SD card socket. This collaboration results in the industry's most power efficient Wi-Fi solution, with an overall power consumption five times lower than...
Plasma-Therm workshop attended by over 140 engineers and scientists
A recent Plasma-Therm advanced plasma processing workshop held in Tel Aviv, Israel, was attended by over 140 engineers and scientists from throughout the country’s growing semiconductor technology sector. Twenty companies (ranging from start-ups to Fortune 500) and six world class universities participated in the full day of presentations focused on applying plasma etching and deposition to the fabrication of electronic, photonic, medical, and ...
Soitec reports total consolidated sales of 137.3 million Euros for H1 2010-2011
Soitec (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) and advanced solutions for the electronics and energy industries, today reported second quarter consolidated sales of 68.7 million Euros giving consolidated sales of 137.3 million Euros for the first six months of the year equal to growth of 45.7% versus the same period last year.
Embedded and Commercial Channel Support Geared up for First AMD Fusion Family of APUs
AMD announced a strong lineup of motherboard products for AMD's 2011 low-power mobile platform (code-named Brazos) and the AMD Embedded G-Series platform for embedded systems (code-named eBrazos), both based on the first AMD Fusion Accelerated Processing Units (APUs). The 2011 low-power mobile platforms feature the new 18-watt AMD E-Series APU (code-named Zacate) or the 9-watt AMD C-Series APU (code-named Ontario).
ULIS debuts I2C infrared sensor Pico384E
ULIS announces today the launch of Pico384E, a new 17-micron pixel size thermal sensor with I2C, the standard Inter-Integrated Circuit link used in many of today’s electronic devices. I2C makes IR sensors compatible with the large-scale production processes used in visible cameras.
picoChip readies industry’s first LTE femtocell reference design
picoChip today announced the availability of the industry’s first LTE femtocell and picocell reference designs, the PC8608 Home eNodeB and PC8618 eNodeB respectively. Both PC86xx family small-cell LTE reference designs build on picoChip’s successes as the leader in femtocells. Both products can be combined with picoChip’s HSPA products and run on the same common hardware platform as the company’s industry-standard WiMAX reference design...
picoChip's femtocell and 4G capability shown at Mobile World Congress ‘09
picoChip demonstrated its leadership in femtocell and 4G technology at Mobile World Congress ’09 with the announcement of an eight user HSPA femtocell solution, and demonstrations of both FDD and TDD variants of LTE. picoChip also showcased the PC302, a cost-optimized SoC solution for HSPA femtocells, while its technology was used to power products and demonstrations on more than 20 stands at the show.
TI introduces products in industry’s thinnest package for portable consumer electronics
Portable consumer electronics designers can save board space with the PicoStar package that Texas Instruments introduced today. The ultra-thin package, about as thin as a human hair, is the first to give system designers the option to embed silicon components inside the printed circuit board to maximize board space. Devices in this form factor are 50 percent thinner than similar chips in traditional packages and enable smaller, thinner end equipm...
Cambridge Consultants develops industry's smallest 2G and 3G femtocell base station
New Sidewinder™ reference design can provide a complete base station on a single PCB
New high-current LED from OSRAM boosts brightness for small projectors with no increase in size
The new OSTAR Compact LED from OSRAM Opto Semiconductors is characterized by improved high-current capability and lower thermal resistance for more light output. It can handle up to 6A in pulsed mode, making it ideal for pico and pocket projectors for small mobile terminals.