Search results for "EDA"
Coil on Module enables thin electronic data page for Turkish passports
Türkiye’s next gen electronic passports with contactless Coil on Module solution from Infineon Technologies.
Siemens extends support for Samsung Foundry’s latest process technologies
Siemens Digital Industries Software announced, at the Samsung Advanced Foundry Ecosystem (SAFE) Forum North America 2023, a range of new certifications and collaborations with Samsung Foundry, resulting in key achievements in enabling Siemens EDA technologies for the foundry’s latest process technologies.
AMD introduces large FPGA-based adaptive SoC
AMD has announced the Versal Premium VP1902 adaptive system-on-chip (SoC), its largest adaptive SoC.
Cliosoft acquisition boosts Keysight’s EDA line up
Keysight Technologies has acquired Cliosoft to strengthen its line of hardware design data and intellectual property (IP) management software tools.
Cadence and Samsung Foundry to expand design IP portfolio
Cadence Design Systems, Inc. has signed a multi-year agreement with Samsung Foundry to expand the availability of Cadence’s design IP portfolio on Samsung Foundry’s SF5A process technology, the latest 5nm process variant to support automotive applications.
Synopsys and Samsung collaborate to deliver broad IP portfolio
Synopsys, Inc. announced an expanded agreement with Samsung Foundry to develop a broad portfolio of IP to reduce design risk and accelerate silicon success for automotive, mobile, high-performance computing (HPC) and multi-die designs.
Keysight microwave and radio frequency at IMS 2023
At the 2023 IEEE MTT-S International Microwave Symposium (IMS), Keysight will highlight microwave and radio frequency (RF) innovations to help customers accelerate 5G and pioneer 6G.
AI-driven Cadence Cerebrus in the OnCloud platform
Cadence Design Systems has announced that Imagination Technologies successfully utilised the AI-driven Cadence Cerebrus Intelligent Chip Explorer and the complete RTL-to-GDS digital full flow to accelerate the delivery of their latest low-power 5nm GPUs.
Keysight signs up to TSMC OIP Alliance
Keysight Technologies has joined the TSMC Open Innovation Platform (OIP) 3DFabric Alliance, which was formed recently by TSMC to accelerate 3D integrated circuit (IC) ecosystem innovation and readiness.
Chipletz selects Siemens’ EDA solutions for its Smart Substrate IC packaging technology
Siemens Digital Industries Software has announced that Chipletz has selected Siemens as its strategic electronic design automation (EDA) provider for the development of its groundbreaking Smart Substrate products.