Tresky offers DIE bonding prototyping and small series production

Investments are not always made based on the respective project and development status. At the same time, many customers want to be able to produce the prototypes and small series as quickly as possible and without any loss of quality. In these cases, they rely on service providers who can take over the production of the sensitive electronic components with extensive experience and detailed knowledge. "That is why, with our technical know-how and based on our years of experience, we are now manufacturing prototypes and small series for our customers from the very first piece on our equipment. Because we can also implement all the necessary processes in our demo centre, our customers have the full manufacturing spectrum at their disposal," says Daniel Schultze, managing owner of Tresky GmbH. In addition to epoxy/adhesive DIE bonding, Tresky offers UV DIE bonding, ultrasonic bonding (US bonding), thermocompression bonding (TC bonding), sintering, DIE stacking, flip chip bonding, DIE sorting and eutectic bonding as a service process.

Especially in a time of high demand for components, the use of these services can be crucial for component manufacturers. That's why Tresky helps its customers reduce time-to-market with its range of services. As an external partner, the company can also quickly produce small series on demand. On the customer's side, it is therefore not necessary to build up additional production capacities, to use existing resources or even to interrupt series production. "This way, our customers get the products they need and can also use the production process to test the performance of our die bonders. Furthermore, we can demonstrate our reliable process capabilities. Customers thus receive an individual demonstration including a production record, which can also facilitate the decision for a machine for subsequent series production," Schultze continues.