Tresky
- Neuendorfstrasse 19 B
16761 Hennigsdorf
Germany - https://www.tresky.de/en/
Tresky Articles
Tresky expands ultrasonic DIE bonding options
Ultrasonic DIE bonding is a fast, clean, and efficient technology increasingly utilised in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This method leverages high-frequency ultrasonic vibrations to create a reliable bonds between semiconductor DIEs and substrates, significantly reducing thermal stress. The advantages of ultrasonic DIE bonding include rapid processing times, low temperatures, and excel...
Laser- and photodiodes DIE bonding in optoelectronics
In the dynamic world of optoelectronics, where light and electronics come together, connection technology plays a crucial role in the performance and lifespan of laser diodes (LD) and photodiodes (PD). Tresky is offering customised solutions that are specially tailored to the requirements of DIE bonding of laser- and photodiodes.
Photonics bonder meets microassembly requirements
The German DIE Bonder specialist Tresky has introduced a highly precise photonics bonder.
Fluxless soldering using formic acid vapor for optoelectronics
Soldering using formic acid vapour in combination with nitrogen (HCOOH + N2) offers significant advantages in assembly and connection technology for applications in optoelectronics and photonics. Especially in the field of sub-micron bonding, Tresky has introduced several products in recent months and is now presenting the formic acid module for reliable use in bonding processes at productronica 2023.
Electronic low-voltage drive module with multifunctional high-current circuit carrier
Tresky GmbH is part of the ProMuPower project at Kiel University of Applied Sciences, which focuses on the development of high-performance power modules and the associated manufacturing processes.
Tresky's process development for reliable sintering with silver pastes
Recently, the German DIE bonding specialist Tresky introduced the reliable pre-sintering process with copper pastes.
Sintering as a key technology for the energy transition and e-mobility
Assemblies with high-performance semiconductors are key components for the global energy transition and electromobility. For this reason, Tresky has been working on this key technology for some time and will present further product and process innovations in 2023 as part of additional development steps.
Rework of LED dies using debonding solution
In times of limited availability of components and materials, reworking takes on a very special significance. This also applies to LED manufacturing, where irregularities in processed LEDs are immediately visible at first sight. This piece from Tresky discusses how its automated debonding solution can enhance LED manufacturing.
Tresky offers DIE bonding prototyping and small series production
In the prototyping phase and when producing small series or batch size 1, many companies shy away from investing in their own Die-Bonder. Often, the final design process has not yet been completed, so downstream changes to the product or even to the manufacturing processes may be necessary. Therefore, the Die-Bonder manufacturer Tresky GmbH from Berlin now offers contract manufacturing of prototypes and small series.