PAC Global at Upcoming SMTA Expos

PAC Global also will demonstrate the new Akrometrix Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

The Akrometrix Interface Analysis software enables 3D, 2D and statistical review of the complete interface at each temperature point during reflow and for the combined data set. Data to be analyzed can be collected with any of the 200+ TherMoiré systems in use throughout the worldwide electronics supply chain today. Introducing unique features such as Pass/Warning/Fail maps, as well as graphical results identifying problem areas based on user inputs, Interface Analysis allows users to see what is happening between two dynamic surfaces throughout the entire reflow process.