Akrometrix has announced that it has launched its newest warpage metrology system – the Tabletop Shadow Moiré (TTSM) system. “Over the years, many of our customers who are using our systems for thermal warpage metrology have stated a need for an ultra-fast, highly accurate room temperature warpage metrology system,” stated Mayson Brooks, Akrometrix President.

  A provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, Akrometrix has announced its next gen Shadow Moiré System – the AXP 2.0.

Akrometrix, a provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, has just announced its next-generation Convection Reflow Emulation Module (CRE6) for warpage metrology.

Akrometrix has introduced its latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms. DIC is the industry standard for strain (CTE) measurements and Akrometrix’s dual camera approach provides unparalleled x-y strain metrology throughout a thermal profile from room temperature up to 300oC.

Akrometrix will exhibit at the GOMACTech 2016 Conference, scheduled to take place March 14-17, 2016 in Orlando, Fl. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC, and provides a forum for government reviews.

Akrometrix has announced that its representative PAC Global will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform.

Akrometrix has entered the Fan Out Wafer Level Processing (FOWLP) market with a single shot full field of view warpage metrology system for panels up to 600 x 600 mm.

Akrometrix will exhibit its TherMoire’ AXP modular metrology platform at productronica. It provides shadow moire’, digital fringe projection, and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real Time Analysis Software along with Array Generation Software.

Akrometrix will exhibit in Booth #134 at SMTA International, 29th to 30th September 2015 at the Donald Stephens Convention Center in Illinois, USA. Company representatives will demonstrate the Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.

Akrometrix will display its latest surface measurement equipment platform, the CXP, on the Microtronic Booth (7-101L) at SMT Hybrid Packaging, which is scheduled to take place from 5th to 7th May 2015.

Akrometrix LLC will present and exhibit at the 36th International Electronics Manufacturing Technology Conference (IEMT), scheduled to take place November 11-13, 2014 at the Renaissance Johor Bahru Hotel in Johor, Malaysia. Ken Chiavone, Vice President of Engineering, will present “Analyzing Package-on-Package (PoP) Reflow Assembly Interfaces with Interconnect Gap Analysis.”

Exhibiting in Booth #541 at SMTA International 2014 will be Akrometrix, with the company planning to demonstrate their Interface Analysis software. The software allows allow high-level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.