Nordson demo X-ray and AOI systems at NEPCON China

The unique Nordson DAGE NT maintenance-free, sealed transmissive X-ray tube, providing 0.1µm feature recognition and up to 10W of power, together with the 3MP long lifetime CMOS flat panel detector makes this the system of choice for the highest performance and highest magnification real-time imaging.

Also on display will be the second-generation Nordson DAGE 4000Plus. The most advanced bondtester on the market performs shear tests up to 500kg, pull tests up to 100kg and push tests up to 50kg, covering all test applications including new hot bump pull and micro materials tests. The camera assist automation system is suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages.

Nordson YESTECH will display the FX AOI and BX AOI systems with advanced 5MP colour camera imaging technology offering high-speed PCB inspection with exceptional defect coverage to inspect solder joints and verify correct part assembly, enabling users to improve quality and increase throughput. The FX Series with one top down viewing camera and four side viewing cameras is configurable for all line positions. The FX Series is equally effective for paste, pre / post-reflow and final assembly inspection. Off-line programming maximises machine utilisation and real-time SPC monitoring provides a valuable yield enhancement solution.

The BX AOI with Advanced Fusion Lighting and 5MP image processing technology integrates several techniques, including colour inspection, normalised correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate. The optional four side viewing cameras add additional inspection capabilities found only on in-line systems.