Nordson DAGE, Nordson MATRIX and Nordson YESTECH, divisions of Nordson Corporation will be exhibiting at the SMT/Hybrid/Packaging exhibition in Nuremberg (May 16-18). Nordson DAGE will demonstrate their flagship system – the new Quadra 7 with 0.1μm sub-micron feature recognition which comes equipped with two 4K UHD displays and 8 million pixels to fully show the 50μm pixel pitch and 6.7MP image size of the Aspire FP detector.

Nordson DAGE has announced that it has been awarded a 2017 NPI Award in the category of Test & Inspection - X-ray for its Quadra 7. The award was presented to the company during a 14th February, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

Nordson DAGE will exhibit at SMTA International (Sept 27-28) at the Donald Stephens Convention Centre in Rosemont, IL and will showcase the Quadra 5 flexible X-ray inspection solution which is said to offer high performance and ease of use for 2D and 3D X-ray applications.

Nordson DAGE and Nordson MATRIX will exhibit at NEPCON South China (Aug 30-Sept 1).  Nordson DAGE will showcase its 4th generation, ultra-high resolution, off-line MXI X-ray system – the Quadra 7 and 4000Plus Bondtester while Nordson MATRIX will showcase its high-speed X3 Inline AXI system.

Nordson DAGE is to exhibit at SEMICON West (July 12-14) in San Francisco. Recognised as a leader in X-ray inspection for electronics, Nordson DAGE will show its 4th generation, ultra-high resolution, off-line MXI X-ray system – the Quadra 7 – for the first time in the Americas’.

X-ray inspection and bondtesting specialist Nordson DAGE has opened an Asian clean room demonstration facility south of Seoul, Republic of Korea. It is a 102 m2 clean room and conferencing center providing all of regional customers with access to Nordson DAGE’s 4800 advanced automated wafer-level bondtester and XM8000 automatic wafer x-ray metrology tool.

Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corp will exhibit their Test and Inspection systems  at SMT/Hybrid/Packaging in Nuremberg. Nordson DAGE makes bond testing equipment and will be showcasing the second generation 4000Plus with camera assist automation which is ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive elect...

Nordson DAGE and MatriX Technologies, divisions of Nordson Corporation, will exhibit at the 2016 IPC APEX EXPO. The Nordson DAGE Ruby and Diamond FP MXI (Manual X-ray Inspection) and MatriX Technologies new X3# AXI (Automated X-ray Inspection) systems will be showcased. 

Nordson DAGE and Nordson YESTECH will exhibit their range of Test and Inspection systems at Productronica – Stand A2.361.  Following the acquisition of MatriX Technologies GmbH by the Nordson Corporation, the new MatriX 2.5# Automated X-ray Inspection system will also be displayed on the stand.    

Nordson DAGE, a division of Nordson Corporation has announced a strategic partnership with the Crest Group for distribution of their market leading Bond Test and X-ray systems in Malaysia and Thailand. Crest also will distribute the Company’s X-ray systems in China. Part of the Advanced Technology - Electronics Systems Group of the Nordson Corporation, Nordson DAGE offers a wide portfolio of Bond Test, Materials Test, Wafer X-ray Metrology ...

Nordson DAGE and Nordson YESTECH, divisions of Nordson, will exhibit in booth 606 at SMTA International, scheduled to take place from 19th to 20th September 2015 at the Donald Stephens Convention Center in Rosemont, IL. Nordson’s team of test and inspection experts will demonstrate the XD7600NT Diamond FP X-ray inspection system from Nordson DAGE and FX-940 AOI In-line PCB inspection system from Nordson YESTECH.

Nordson DAGE and Nordson YESTECH, divisions of Nordson, are pleased to announce that their products will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from 29th to 30th September 2015 on the show floor of SMTAI. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.

  At SEMICON West 2015, which takes place from 14th to 16th July at the Moscone Center in San Francisco, Nordson DAGE will exhibit in booth 5744. Here, the company will present the 4800 wafer level Bondtester for the first time in North America.

Nordson DAGE will exhibit its portfolio of test and inspection equipment in Booth No. 7A-131 at SMT Hybrid Packaging, scheduled to take place 5th to 7th May 2015, Nuremberg, Germany. The highlight of the exhibition will be the Xi3400 Automated X-ray Inspection System (AXI), which will be making its European debut at the show.

  A team of test and inspection experts will be demonstrating the 4000Plus Bondtester and XD7600NT Diamond FP X-ray inspection system at NEPCON CHINA 2015, scheduled to take place 21st to 23rd April. Nordson DAGE will exhibit at Stand B-1F28.

Nordson DAGE has introduced a new test method for the evaluation of die strength by means of cantilever bending where 3 point bending is not suitable for die with a thickness of less than 50 microns. Die with thickness below 50 microns tend to be very compliant, in fact so much so that it becomes virtually impossible to apply a test load.

  Nordson DAGE has announced its most recent order from a major customer in the semiconductor industry for its XM8000 wafer X-ray metrology tool. It will be used for the automatic measurement of wafer bumps and Through Silicon Vias (TSVs) using 2D and 3D x-ray inspection methods.

Peter Koch, European X-Ray Application Engineer, at Nordson Dage is lined up to present at their Distributor Etek’s Technology Event, in Prestwick, Scotland (Nov 5-6). He will present “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT.” Koch will discuss failures on BGAs, HiP (Head in Pillow) defects, cracks and simple failures such as solder bridges.

Suitable for in-line or off-line operation, Nordson DAGE has introduced an automated x-ray inspection system. The Xi3400 offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. The system's algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.

At the upcoming SMTA International exhibition, Dr. Evstatin Krastev, Director of Applications, Nordson DAGE, will present two papers. Dr. Krastev co-authored both papers, titled: 'X-ray / Bondtester Reliability Study of BGA Devices – Impact of Interfacial Voiding' and 'Optimizing X-ray Inspection with Package on Package'.