Mirtec to present at the California Reliability Workshops

Technological achievements within the electronics industry have led to ever-increasing PCB density and complexity.  As the manufacturing process becomes more complicated, there is an increased probability for defects to occur on finished PCB assemblies, thereby providing an equal level of complexity for the inspection process.

For years the electronics manufacturing industry has relied solely upon two-dimensional (2D) inspection principles to test the quality of workmanship at each phase of the electronics assembly line; post-solder deposition, post-placement and post-reflow. The advent of 3D inspection technology; however, provides electronics manufacturers a much needed competitive edge with which to maximize efficiency, increase first pass production yields, and reduce the need for non-value added rework and repair.

It is important to understand; however, that there are advantages and disadvantages associated with both 2D and 3D inspection technology. Therefore, in order to achieve the highest level of quality assurance, manufacturers must employ a combination of both 2D and 3D inspection technology throughout the manufacturing process.

D’Amico has more than 33 years of experience in the electronics manufacturing and test equipment industry.  In 2004 he and his partner, Chanwha Pak, established MIRTEC’s North American Sales and Service Division.  Leading a team of talented sales and support professionals, D’Amico has achieved remarkable success in making MIRTEC inspection systems a recognized leader throughout North America.