MIRTEC at IPC APEX 2016

The MV-6 OMNI 3D AOI Machine is configured with MIRTEC’s OMNI-VISION 3D Inspection Technology which combines a 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s Digital Multi-Frequency Quad Moiré 3D system in a newly designed  platform.  

MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with its complete product range of 3D inspection systems.  MIRTEC’s Digital Multi-Frequency Quad Moiré Technology provides true 3D inspection using a total of four Programmable Digital Moiré Projectors to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow.  Fully configured, the new MIRTEC MV-6 OMNI machines feature four 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.   MIRTEC will have two MV-6 OMNI’s on display, one configured with a 10um lens for High-Performance applications and the other with a 15um lens for High-Speed applications.

MIRTEC’s MS-11E 3D SPI Machine is configured with MIRTEC’s 15MP CoaXPress Vision System, providing enhanced image quality, accuracy and fast inspection rates.

The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging.  The MS-11e uses the same robust platform as MIRTEC’s MV-6 OMNI Series.

MIRTEC will have two MS-11e’s on display one configured with a 10um lens for High-Performance applications and the other with a 15um lens for High-Speed applications.

MIRTEC’s MV-7 OMNI-QHD 3D AOI Machine features the next generation OMNI-VISION 3D Inspection Technology in a High-Performance AC Servo Drive Platform.  This  combines a 15MP CoaXPress Vision System with MIRTEC’s  Quantum High Definition (2048x1536) Digital Multi-Frequency 3D Projection Technology to provide good image quality, accuracy and repeatability necessary for precision inspection of SMT devices on finished PCB assemblies. The MV-7 OMNI-QHD machine also features four 10 Mega Pixel Side-View Cameras for inspection of Regions of Interest which are not accessible with the 15 MP Top-Down Camera. 

MIRTEC’s MV-6E In-Line AOI Machine combines a 10 Mega Pixel Top-Down camera with a Precision 13.4um Telecentric Compound Lens and four  10 Mega Pixel Side-View Cameras in a newly designed platform. The MV-6e is also configured with MIRTEC’s  INTELLI-SCAN 3D Laser System, providing superior lifted lead detection for gull wing devices and four-point height measurement capability for co-planarity testing of BGA and CSP devices.

The MV-3L Desktop AOI Machine is a five camera desktop AOI system.  This system is configured with one Top-Down View 10 Mega Pixel camera with a Precision 13.4um Telecentric Compound Lens and four 10 Mega Pixel Side-View Cameras.  It also features the INTELLI-BEAM 3D Laser System. This provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.