GÖPEL has announced its THT Line 3D system

The latest innovation, a state-of-the-art 3D camera module, revolutionises failure detection and at the same time significantly reduces the false call rate when measuring critical THT solder joints. The test time is also considerably reduced. GÖPEL electronic is thus setting new standards in the double-sided, parallel inspection of THT assemblies.

One part of this new development is the camera-lens combination, which is characterised by high-resolution image acquisition, a larger field of view (FOV) and an increased image-capturing speed. In addition to the 3D measurement of THT pins and its solder joints, this higher resolution makes it possible to inspect SMD components up to the package size 0201. Especially for selective soldering, this allows the inspection of SMD components which are close to the THT solder joints.

This camera module is also characterised by a telecentric lens with a measuring range of up to 35 mm, which is advantageous when using different carriers in the production process. As the PCB-A level can vary by several millimetres in relation to the transport level in such applications, this new camera module has no longer any limits for both 3D measurements and 2D inspections.

Another groundbreaking innovation of this camera module is the integration of a reflection reducer, which significantly increases data quality in critical layout situations during 3D measurements on the solder side of the assembly. Especially steep, very shiny and closely spaced solder joints can lead to reflections, which causes incorrect height information during 3D measurements. This effect is physically based and all 3D AOI systems are faced with this issue. Although the data can be corrected using various interpolation methods, it does not necessarily correspond to reality. To avoid this, GÖPEL electronic has integrated a "Reflex Reducer" into the 3D camera module, which eliminates this disturbing effect and increases the reliability of the 3D measurement.

The THT Line 3D enables the inspection of THT components, THT solder joints and SMD components in one system. Assemblies can be fed automatically or manually with or without carriers. The PILOT AOI system software offers the user a high level of operating convenience and maximum failure detection thanks to different inspection methods. The proven MagicClick tool generates a production-ready inspection program including the component library in just a few minutes.