GÖPEL electronic's integration packages offer a powerful combination of hardware and software for seamless integration in Automatic Test Equipment (ATE).

FlashFOX will be updated with new features that further enhance its versatility and ease of use.

Mick Elliott, Contributing Editor gets the lowdown on GÖPEL Elektronik's Multi-Line test platform from Andreas Türk, Product Manager Inspection Solutions at GÖPEL

As part of the SYSTEM CASCON software platform from GÖPEL electronic, Test Coverage Analyzer (TCA) has been a powerful tool providing detailed information regarding test coverage and possible test gaps.

GÖPEL electronic has announced its THT Line 3D system, taking its THT assembly inspection to a new level.

With the MultiEyeS plus, GÖPEL electronic offers a powerful automatic optical inspection module for integration into assembly and THT placement stations.

At productronica 2023, Ricardo Schmidt, Project Manager at GÖPEL electronic talks to Electronic Specifier Editor, Mick Elliott, about its product, the Flash Fox Programmer.

GÖPEL electronic’s FlashFOX production programmer recently achieved second place at the productronica innovation award in the Inspection & Quality Cluster.

With the new generation of MultiEyeS plus, GÖPEL electronic presents an innovative further development of the inspection solution for THT placement. MultiEyeS plus is a smart automatic optical inspection module for integration into assembly and THT assembly stations. 

GÖPEL electronic presented its innovative robotics setup at the Automotive Testing Expo Europe in Stuttgart. The trade fair demonstrator for practical illustration of automated test procedures was a real visitor magnet at the trade fair stand. 

GÖPEL electronic presents with the new system Vario Line, 3D SPI an innovative system solution for the 3D inspection of solder and sintering pastes. 

At GÖPEL electronic, the network of distributors is continuously expanding. They have recently agreed to work closely with Agentek (1987) to further establish their inspection solutions in Israel.

GÖPEL is proud to present its automotive test technologies at Vehicle Electronics & Connected Services (VECS) 2023.

The product family of SCANFLEX TIC modules from GÖPEL electronic has grown. As a highlight at this year's SMTconnect in Nuremberg, the new SFX TIC022-HVPRG/SR will be presented.

At the SMTconnect in Nuremberg, GÖPEL electronic will inform how we meet the coming requirements in electronics manufacturing with our solutions in a forward-looking way.

The anticipation for electronica, the most important electronics industry meeting place, is also growing at GÖPEL electronic.