Flying probe, boundary scan combo enhances testing

With many devices now being manufactured in BGA or extremely fine pitched leaded packaging, the need to have boundary scan to control these devices is critical to achieving the best coverage.

Furthermore being able to use flying probes to reach parts of the circuit with no JTAG access allows boundary scan testing to achieve maximum coverage.

The integration allows test engineers to shorten test cycle times at the same time as increasing test coverage.

Commenting on the collaboration with XJTAG, Jörg Lewandowski, Managing Director, Systech Europe, says: “Test engineers face increasing pressure with devices that have little or no access to their pins, and space for test points is under pressure. At Systech Europe we are constantly looking out for the best test solutions for our clients and found that XJTAG boundary scan is easy to use, offers great functionality at a very competitive price, and comes with a flexible licensing model.”

Test cycle times are reduced by optimising the number of probe movements carried out by the flying probe machine.

Test coverage is increased by combining the physical access facilitated by the flying probes with XJTAG’s ability to control the boundary scan technology built into many of today’s processors and FPGAs to control the signals on those devices.

Simon Payne, CEO of XJTAG, comments: “We are delighted to be working closely with Systech Europe. They have a great understanding of the challenges faced by the electronics industry across many sectors including defence, aerospace, automotive, medical, industrial and semiconductor throughout Europe.