Semikron launch SKiiPX IGBT modules for wind turbines

The internal construction of the SKiiPX is based on Semikron’s SKiN Technology, which provides a doubling of the power density within the module. Consequently, the total volume of the inverter can be decreased by up to 50% and inverter costs can be reduced by up to 15%. SKiiPX allows for the first time the integration of a 3MW wind inverter into a single cabinet, due to a reduced number of components and interfaces. The high integration level also reduces the probability of an inverter failure – expressed by the Failure-In-Time (FIT) rate – by 30%.

A newly-designed integrated liquid cooling system allows for a constant operating temperature of the coolant of up to 70°C. This hermetically sealed system requires fewer gaskets compared to conventional systems, ensuring higher reliability. As a result, the SKiiPX is the most reliable module in the market for operation under extreme climatic conditions.

The SKiiPX is supplied as a fully tested subsystem (IPM) with integrated gate driver electronics, cooling and protection functions, thus reducing the design and integration effort for the complete system for the customer.

The innovative SKiN Technology is a Semikron proprietary packaging technology that eliminates the use of solders and bond wires. It replaces the conventional bond wires by a flexible foil. In combination with sinter technology, it offers a doubling of power density in the application. It increases the load cycling capability by a factor of ten compared to soldered modules.