STMicroelectronics and Semikron team up on power modules

The two companies have agreed to combine their complementary competences to offer robust and cost-effective power solutions and use the new module range to expand their respective market coverage.

This collaboration creates new opportunities for traditional power devices, including IGBTs and power MOSFETs, as well as for ST’s proprietary ESBT (Emitter-Switched Bipolar Transistor) devices, which cost-effectively combine power bipolar and power MOSFET structures to offer both high voltage capability and high switching frequencies.

The SEMITOP package allows several chips, such as IGBTs (Insulated-Gate Bipolar Transistor), diodes, and input bridge rectifiers, to be integrated in a single module. Package-level integration reduces the component count and board space of discrete solutions, while ensuring superior connectivity and inherent reliability. The use of advanced processes and materials, including DBC (Direct Bond Copper) ceramic substrate and internal gel coating, results in excellent thermal management and immunity to external temperature variation and mechanical stress.

The new integrated power modules from ST and Semikron are set to address the rapidly growing demand for more integrated and reliable high-power platforms in a wide range of segments and applications, including Welding, UPS, Home Appliance, Motor Drive, and Switched Mode Power Supplies.

Volume production of the new integrated power modules will start in soon. ST and Semikron will market them independently, assuring a dual source and securing a better supply of these devices for customers.