PSMA to Host Power Supply-on-Chip Special Presentation at APEC 2010

Semiconductor companies are playing an increasingly significant role in the miniaturization of power supplies through their ability to deliver advanced processing and functional integration in the form of system-in-package and system-on-chip platforms. A major R&D challenge currently being addressed by both industry and academia is the cost-effective integration of the passive components within the chip-scale package or on the functional silicon. This special presentation session will address current trends in technologies, components (both active and passive) and applications that are driving miniaturized power supply product formats. Attendees will gain insight into some of the key challenges and opportunities that lie ahead for new and emerging products in the area of integrated power solutions.

Dr. Cian Ó Mathúna, Tyndall National Institute and Brian Narveson, Texas Instruments, co-chairs of the PSMA Packaging Technical Committee, issued a joint statement. This Special Presentation Session provides a valuable update to the recently published PSMA technical and market report and presents a timely opportunity for attendees to interact with other professionals who have an active interest in this potentially disruptive product space. We encourage our engineering colleagues to register for APEC 2010 and make plans to attend this Special Presentation Session and to consider participating in the other PSMA sponsored meetings during the week.