Power Supply in a Package - Power Supply on a Chip - a new report by the PSMA

Cian Ó Mathuna, co-chair of the Steering Committee for this project, commented, At this early stage in the Power Supply in Package and Power Supply on a Chip evolution, this report presents a valuable opportunity for the industry to take stock and obtain an overview of the technology and product trends that are evolving, what the technology and market drivers are and what the market opportunities will be over the coming years. The study will also provide valuable insights into future technology roadmaps and R&D challenges that need to be addressed.

The Market and Technology Report is the result of a comprehensive survey undertaken by Anagenesis, Inc. that involved in-depth interviews with major players, as well as reviews of industry and academic reports and literature — all of which have been subject to detailed analysis and assessments by the consultants.

Brian Narveson, Steering Committee co-chair, stated, The proliferation of functionally integrated hardware solutions is a move away from the traditional power supply manufacturing route of using discrete component to an increasing emphasis on power supply products employing functionally integrated devices directly from the semiconductor and microelectronics industries. Advances in semiconductor, magnetic, capacitor and packaging materials and technologies that will deliver products operating at multi-MHz frequencies are augmenting this trend.