Semikron launches MiniSKiiP Dual module to double power capability to 90kW

The key benefits of the MiniSKiiP family are user-friendly spring technology for the power and control terminals as well as simple, cost-effective and solder-free single-screw assembly of the circuit board, cooling unit and module. MiniSKiiP is primarily used in industrial motor drives, solar inverters and power supplies.

This is the first time that MiniSKiiP spring technology has been made available for power ratings higher than 40 kW. The benefits: lower material costs compared to traditional inverter designs because the expensive bus-barring of the load connectors can be replaced by a cost-efficient PCB connection; and fast, solder-free assembly, which can reduce the system costs by up to 15 percent. The spring contacts make the layout of the printed circuit board (PCB) simpler and more flexible because the PCB does not need holes for solder pins. Also, the springs allow for a more flexible connection between the PCB and the module than a soldered joint, which adds extra benefits, particularly under thermal and mechanical stress.

The MiniSKiiP Dual’s output of up to 90 kW requires higher current-carrying capability of the PCB, which can, for example, be achieved by using a 210µm standard metal coating on the PCB. This allows for load currents up to 180ARMS, which used to be possible only with modules with screw-mounted busbars.