Efficient power conversion from grid to core is critical for achieving higher power densities, improving computing performance, and reducing total cost of ownership (TCO). In response, Infineon Technologies is introducing the TDM2354xD and TDM2354xT dual-phase power modules, which deliver top-tier power density for high-performance AI data centres. These modules enable true vertical power delivery (VPD) and lead the market with a current density of 1.6 A/mm², following the earlier release of the TDM2254xD modules.
“We are proud to enable high-performance AI data centers with our TDM2354xT and TDM2354xD VPD modules. These devices will maximize system performance with Infineon’s trademark quality and robustness, thereby enabling best TCO for data centers,” said Rakesh Renganathan, Vice President Power ICs at Infineon Technologies. “Our industry-leading power devices and packaging technologies, combined with our extensive systems expertise, will further advance high-performance and green computing as part of our mission to drive digitalization and decarbonization.”
The TDM2354xD and TDM2354xT modules incorporate Infineon’s durable OptiMOS 6 trench technology, a chip-embedded package that enhances power density through improved electrical and thermal efficiency, alongside a new inductor technology for a lower profile and true vertical power delivery. These innovations establish new benchmarks for power density and quality, maximising the efficiency and performance of AI data centres. The TDM2354xT modules can handle up to 160 A and are the first in the industry to feature Trans-Inductor Voltage Regulator (TLVR) technology in a compact 8 x 8 mm² form factor. Paired with Infineon’s XDP controllers, they deliver ultra-fast transient response and reduce on-board output capacitance by up to 50 percent, further increasing system power density.
These new modules will be showcased at Infineon’s global technology event, OktoberTech 2024, in Silicon Valley on 17th October, and at electronica 2024 in Munich from 12-14 November.
