Stacked SMPS MLCCs target high temperature environments

22nd August 2014

AVX

Nat Bowers

0 0

Datasheet

Expanding the company's high temperature SMX series of stacked SMPS MLCCs, AVX has added versions with 25V ratings in 3-5 case sizes and 500V ratings in 1-6 case size. Compared to typical MIL-qualified MLCCs and comparable wet tantalum capacitors, the SMX series delivers excellent high frequency performance and capacitance retention with frequency, high current handling capabilities and low ESR, ESL and DC leakage.

Operating over a temperature range from -55 to +200°C, the MLCCs are designed for use in high temperature, harsh environment applications, including: down-hole oil, gas and mineral exploration; military, defence and weapons systems; space and satellite communications; automotive underhood and HEV; rugged AC/DC power converters; DC filters in high power, high frequency ripple currents, high pulsed-current circuitry, and a range of low power electronics; EMI filters on AC inputs; DC link capacitors for AC/AC and DC/AC motor drive inverters; and start-and-run capacitors in AC induction motors.

Constructed using high temperature solder, the capacitors provide rugged thermal shock, mechanical shock, moisture resistance and vibration resistance capabilities per MIL-STD-202. The stacked SMPS capacitors are available in C0G and X7R dielectrics, six case sizes, voltage ratings of 25-500V and capacitance values of 0.0039-270µF.

Customisation options include custom geometries, packages, terminals, lead configurations and stress relief mounting options. This enables engineers to achieve higher efficiency, space-saving designs with enhanced mechanical and thermal reliability.

Stan Cygan, Senior Applications Engineer, AVX, stated: “With the addition of the new capacitance and voltage ratings, AVX’s extensively customisable SMX series now offers the widest selection of stacked SMPS capacitors rated to 200°C in the industry, providing much-needed design solutions for an even broader range of high temperature, harsh environment applications than before.”