MLO diplexers boast lowest profile in market

14th January 2014

AVX

Staff Reporter

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Claiming to offer the lowest profile 0603 and 0805 MLO diplexers available in the global market, the devices from AVX are based on the company's patented multilayer organic high density interconnect technology. The 0603 and 0805 MLO diplexers, when compared to equivalent LTCC devices, exhibit superior attenuation, low insertion losses, low parasitics, high heat dissipation, and excellent solderability.

The 0603 and 0805 MLO diplexers employ high dielectric constant and low loss materials to realize high Q passive printed elements, such as inductors and capacitors in multilayer stack ups. Expansion-matched to PCBs, the devices also provide improved reliability compared to ceramic and silicon components.The 0603 and 0805 MLO diplexers measure 0.42mm (0.017”) and 0.55mm (0.021”) in height, respectively.

Rated for temperatures spanning -40°C to +85°C and, respectively, for maximum power capacities of 4.5W and 5W, the MLO diplexers are 100% tested for electrical parameters and visual characteristics. They are available with Ni/Au, Ni/Sn, and OSP coatings, all of which are compatible with automatic soldering technologies.

The devices are designed for band switching in dual and multiband systems, such as WiFi and WiMax (WLAN/BT); mobile telecommunications, including 3G and 4G LTE (WCDMA, CDMA, and GSM); and GPS.

“At heights of 0.55mm or less, our best-in-class 0603 and 0805 MLO diplexers are the lowest profile diplexers currently available in the global market, which proves especially beneficial for engineers engaged in designing next-generation mobile devices,” commented Larry Eisenberger, Senior Marketing Application Engineer at AVX.