Cost-effectively transfer heat away from components
Die-cut thermal interface gaskets from Fujipoly are a cost-effective and easy way to transfer heat from electronic components to the surrounding environment. When placed between a heat source and a heatsink, the gaskets conform to all uneven surfaces and fill any air gaps. This significantly increases surface contact with the heatsink thereby increasing cooling efficiency.
The physical characteristics of this product also allow it to act as a low-pressure mounting cushion to prevent deformation. In addition to a large stock assortment of gaskets, the company offers custom die-cut shapes to fit virtually any application.
Each of the gaskets can be ordered in your choice of over a dozen Sarcon thermal interface material formulations. Depending on your material selection and thickness, the gaskets will provide a thermal conductivity between 0.9 and 17.0W/m°K with a thermal resistance of 0.03 to 3.47°Cin2/W.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
|---|---|
| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
|---|---|
| Stock: | 8000 |
| Cost: | $5.42 |
