Fujipoly recently released SARCON GR100A series, its newest high-performance, thermal gap filler pad.

Fujipoly America introduces SARCON CF210A, the newest Fujipoly thermal gap filler. CF210A incorporates carbon fibers along with traditional fillers found in thermal gap filler materials.

SARCON PG130A from Fujipolyn is one of the industry’s high-performing thermal interface materials that is extremely compressible.

Sarcon 15GTR from Fujipoly is a thin, thermal interface composite film made from heat-conducting silicone and a .05mm fibreglass reinforcement layer. The general-purpose, .15mm thick film is ideal for applications with complex die-cut shapes. 

Fujipoly's Sarcon PG25A is said to be one of the company’s softest and best performing thermal gap filler pads for applications that have delicate components and high compression rates. When it is sandwiched between components of varying shapes and sizes and a nearby heat sink or spreader, this compliant 2.5 W/m°K material exhibits a thermal resistance as low as 0.42°Cin2/W at 14 PSI.

SARCON SPG-30B from Fujipoly is a new form-in-place thermal gap filler that eliminates performance-hindering air gaps ranging from .08mm to 1.0mm. SPG-30B is said to deliver a superior thermal conductivity of 3.1 W/m°K with a thermal resistance of only 0.33°Cin2/W. 

The Zebra 1002 Carbon Connector from Fujipoly offers electronic device manufacturers an extremely affordable and reliable option for connecting printed circuit boards to a variety of LCD displays. The unique layered construction of this interconnect device includes 240 alternating layers of conductive and non-conductive silicone per inch allowing it to accommodate contact pad spacing as close as .015” (0.38mm).

Fujipoly’s SARCON 30XR-Um Thin Film putty-like thermal gap filler pad exhibits a thermal conductivity of 17 watt/m-k and a thermal resistance of only 0.02 °Cin2/W.

The Zebra Gold Series 8000C connector from Fujipoly transfers both data and power between parallel components and circuit boards while exhibiting low electrical resistance. This interconnect device is constructed from a low durometer silicone core that is wrapped with 166 parallel rows of flat, gold-plated copper wires per inch.

Fujipoly has announced its Self-Supporting Sponge Connectors which provide engineers with an excellent, low-force option for connecting LCDs to circuit boards. The physical characteristics of the sponge dramatically reduce bowing of the PCB due to the minimal force required to make full electrical contact. This also makes the connector a great choice for high-vibration environments and hand-held devices.

Fujipoly’s Stay Cool and Get Connected giveaway attracted hundreds of engineers and industry professionals hoping to win simply by filling out an online entry form that asked participants to name one of the company’s products. Fujipoly has announced that Kimberly Richley from Thermo Fisher Scientific in Franklin, MA is this year’s winner. According to Kimberley, her favourite product is Fujipoly Fusible Tape. She won a...

  Fujipoly has introduced high-performance, glass fabric reinforced thermal interface materials designed to deliver high thermal conductivity (3.0 W/m°K) while exhibiting a thermal resistance as low as .17°Cin2/W.

What look like zebra stripes running down the middle of this high density connector are actually alternating layers of electrically conductive carbon-filled and non-conductive silicone rubber. Fujipoly’s 2005 Zebra connectors pack a 500 conductive layers per inch, making it one of the most reliable and cost-effective ways to connect an LCD to a PCB.

The introduction of Sarcon YR‐c by Fujipoly gives electronic packaging engineers an unprecedented level of performance from a thin film, thermal interface product. The new formulation delivers a thermal conductivity of 4.0 W/m°K with a thermal resistance of only .08°Cin2/W.

Fujipoly has introduced Sarcon PG80A, its newest high-performance, low compression force, putty-like thermal interface material. The 13 W/m°K gap filler pad gently conforms to most component shapes and uneven surfaces to transfer heat from its source to a nearby heat sink or spreader while exhibiting a thermal resistance as low as 0.08°Cin2/W at 14 PSI.

Sarcon GR80A, from Fujipoly, is a soft, high-performance thermal interface material that exhibits a low thermal resistance and can be supplied in sheets from 0.3mm to 3.0mm thick and can be die-cut to fit almost any application shape.  

Hailed as a low-cost, long-life option for LCD to PCB connections or as a board to board connector where space is limited, the 5002 series silver Zebra connector has been introduced by Fujipoly. This connector delivers a current carrying capacity up to 300mA per square 25.8064mm (square 0.040”) and exhibits a contact resistance of less than 500mΩ.

  Among the industry's highest performance form-in-place gap filler compounds, SARCON SPG-50A from Fujipoly is a 5.0 W/m°K silicone based material suited for electronic devices that have delicate components or ultra-low compression force requirements.

One of the most challenging issues when using LEDs is thermal dissipation. These lighting packages typically generate a significant amount of heat. If it is not managed correctly, this can severely limit the efficiency, output and useful life of the LED. One of most common ways to remove this performance-hindering byproduct is to use a heat sink.

Fujipoly have released their self-supporting sponge connectors, which are suitable for connecting LCD panels to circuit boards with a very low deflection force. Each connector is made from an economical and reliable Zebracore that is sandwiched between two soft sponge supports.