Three-Dimensional Arrangement of LEDs

The “Three-dimensional Arrangement of LEDs – Innovative Production Technologies” workshop at the “3rd International LED professional Symposium” (LpS 2013) will cover laser direct structuring (LDS) of 3-D molded interconnect devices (3-D MID) and the associated opportunities for LED lighting from September 24 to 26 in Bregenz. Specialists will present the LDS process, along with the available materials and automatic assembly. The presentation of the technology will be supplemented by a talk on specific customer applications. Specialists from Essemtec AG, LPKF Laser & Electronics AG, MID-Tronic GmbH and RF Plast GmbH will appear as presenters.

Upgrading of three-dimensional plastic bodies with strip conductors is the domain of LDS. The conventional component thus takes over electronic functions. Components that are manufactured with this technology can be found in more than half of the smartphones available today. The advantages are obvious: The LDS components are much smaller and lighter, can be quickly adapted to new requirements and also cut down the need for separate components.

 With LDS components, two important requirements for LED lights are met. LED lights achieve a 3-D directional characteristic and using heat-conducting plastics as the carrier material solves the temperature problem.

LPKF will present another innovation in Bregenz: a metallic carrier is coated with an LDS-capable coating powder and can be provided with metallic conductors after laser structuring. Completely new areas of application thus result: metallic bodies of any shape are transformed into carriers for LEDs, and also act to discharge heat. A first sample built using this technology also serves as the cover picture of the invitation – an LED light that is similar to a conventional car lamp in size and appearance.

Essemtec, the Swiss manufacturer of production systems for electronics, is going to introduce the latest three-dimensional dispensing and placing technology of LED components. Essemtec has developed a fully automatic 3-D dispensing and SMT placement machine Hydra in a close collaboration with MID-Tronic, a producer of 3D-MID products who will talk about his experiences within the workshop as well.

Essemtec combines a standard 2D-SMT pick-and-placer of the Paraquda series with a 6-axes robot. The robot positions the substrate holder on an always horizontal placement level. Therefore the system operation of Hydra is similar to a standard SMT pick-and-place machine and it can be integrated easily into a typical electronics production.

The Hydra features an inline conveyor system and quick changeover, making it capable of series production as well as small series and sample manufacturing. It can dispense glue in nearly any position and assemble SMD components accurately. The 3-axes pick-and-place head can place up to 2,500 cph in 3-D mode and up to 12,000 cph in 2-D mode.

Find more information on the symposium and register for the workshop visit the website (participation fee 180.00 Euros).