Laser system suits mixed-component assembly PCBs

Multi-ɸ optimises laser exposure diameters to fit any component size or board patterns. The variable spot diameters allow soldering to diverse component shapes or various land patterns, similar, says the company, to the tip sizes and shapes available with hand soldering. The beam spot diameters are adjustable within a 0.1-3.0mm range. The diameter range is determined by optical fibres and lens configuration.

The laser’s output power is converted into thermal energy, and the robot’s z-axis (vertical) stays fixed when adjusting the beam diameter. Multi-ɸ supports a variety of soldering patterns. A new feeding mechanism feeds solder wire from any direction, for flexible working. By optimising soldering conditions for the entire circuit board, the equipment achieves the shortest laser irradiation period, according to the company.