Increase surface area contact between component & heat sink
One of the most challenging issues when using LEDs is thermal dissipation. These lighting packages typically generate a significant amount of heat. If it is not managed correctly, this can severely limit the efficiency, output and useful life of the LED. One of most common ways to remove this performance-hindering byproduct is to use a heat sink.
To maximise cooling performance, Fujipoly offers a full line of extremely soft, Sarcon GR-ae thermal interface materials. These gap filler pads dramatically increase surface area contact between the component and heat sink.
The cost-effective silicone based material is available in nine thicknesses that deliver a thermal conductivity of 1.3W/m°K with a thermal resistance as low as 0.50°Ccm2/W. Sarcon GR-ae is available in pre-cut sheets up to 200x300mm or can be die-cut to fit your exact application specifications.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
|---|---|
| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
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| Stock: | 8000 |
| Cost: | $5.42 |
