Mixed Signal/Analog

Vishay Intertechnology has introduced a 1.4x1.8mm miniQFN10 package with an ultra-thin 0.35mm profile, providing a space-saving alternative to larger miniQFN10 and WCSP devices commonly used in portable applications. The Vishay Siliconix DG2592 audio jack detector and DG2750 low-voltage dual SPDT analogue switch are the first devices in a new family of solutions to feature the enhanced package.

CEVA has announced that iCatch Technology has licensed the CEVA imaging and vision DSP for its next-gen SoCs targeting the automotive, drone, surveillance camera markets. iCatch will leverage the powerful computer vision and image enhancement capabilities of the DSP to significantly enhance the feature set offered in their smart camera SoCs.

PCB Piezotronics has launched a ½" microphone and preamplifier system, model 378A04, understood to be the industry’s first prepolarised low-noise device capable of measuring 6.5dBA (5.5dBA typical), matching the specification of existing externally polarised models. This unique ICP sensor is designed for use with Data Acquisition Systems (DAQs) that provide industry standard constant current power.

Analog Devices has introduced a revolutionary addition to its power conversion platform with an innovative series of mixed-signal control processors. The ADSP-CM41x series is designed to dramatically simplify system design, lower cost, and improve efficiency and safety in solar, energy storage and EV infrastructure.

Synopsys has announced the availability of its Verdi Advanced AMS debug solution. With today's mixed-signal SoC designs combining analogue and digital components in complex design architectures, Synopsys' Verdi Advanced AMS debug solution enables SoC teams to seamlessly debug co-simulation of analogue, digital and mixed-signal subsystems within a unified debug environment, saving valuable verification cycles, increasing overall productivity and a...

Nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) present a frequency division duplex (FDD) balance network, capable of dual-frequency impedance tuning for all LTE bands in the 0.7-to-1GHz range. When integrated into an electrical-balance duplexer (EBD), it enables FDD duplexing with antennas in real-world environments, paving the way to high-performance, low-power, low-cost solutions for mobile communication.

LG Electronics has licensed the CEVA imaging and vision DSP for its mobile device product lines. The DSPs address the extreme processing requirements of the most sophisticated computational photography and computer vision applications such as video analytics, augmented reality and ADAS.

Delivering data throughput rates of 600Mb/s (up to four times faster than competing digital isolators), Analog Devices has introduced an LVDS digital isolator series. The ADN465x series ensures safety and reliability through proven galvanic isolation in a single package while delivering ultralow jitter at 70ps and 4.5ns max propagation delay.

A new SP2T reflective switch from M/A-COM Technology Solutions is available at Richardson RFPD with full design support capabilities.  The MASW-011060 is a high-power PIN diode SP2T switch in a common anode configuration, operating from 0.5GHz to 6.0GHz. It features low insertion loss and excellent linearity and is capable of handling 100W continuous wave of incident power at a base plate temperature of 85ºC.

It has been announced that the Circuit Seed family from InventionShare, a family of circuit building blocks for processing analogue signals using fully digital components and design flow, are now able to improve functionally of mobile phone offerings from all manufacturers. The graphic below shows the impact of Circuit Seed on a smartphone.