Alphawave announces 9.2Gbps platform

Building on the company’s established HBM3E IP, this platform achieves a remarkable chiplet-enabled memory bandwidth of 1.2 Terabytes per second (TBps), meeting the increasing demand for ultra-high-speed connectivity in high-performance computing (HPC) and accelerated computing for generative artificial intelligence (AI) applications.

Alphawave Semi has successfully showcased its HBM3E IP subsystem at recent industry events. In collaboration with Micron, channel simulations have demonstrated top-tier performance of 9.2 Gbps in an advanced 2.5D package across a full HBM3E system, which includes the HBM3E IP subsystem, an Alphawave Semi innovative silicon interposer, and Micron’s HBM3E memory. These results highlight the platform’s capability to significantly reduce time-to-market while delivering exceptional performance and power efficiency for data centre and HPC AI infrastructures.

HBM3E is becoming a preferred memory solution for AI and HPC systems due to its superior bandwidth, latency, compact size, and power efficiency. Alphawave Semi's customers are deploying comprehensive HBM subsystem solutions that combine the company’s HBM PHY with a flexible, JEDEC-compliant, highly configurable HBM controller, which can be optimised for specific AI and HPC workloads.

Additionally, Alphawave Semi has developed an optimised silicon interposer design to ensure best-in-class signal integrity, power integrity, and thermal performance at 9.2 Gbps.

“Micron is committed to advancing memory performance through our comprehensive AI product portfolio as the demand for AI continues to grow in data centers,” said Praveen Vaidyanathan, Vice President and General Manager of Micron’s Compute Products Group. “With their end-to-end channel simulations, we are pleased to see Alphawave Semi demonstrate a performance of 9.2 Gbps for AI accelerators with HBM3E. Together, we are empowering customers to accelerate system deployment with our Micron HBM3E solutions, delivering up to 30% lower power consumption compared to competitive offerings.”

“We are excited to lead the industry in delivering a complete 9.2 Gbps HBM3E PHY and controller chiplet-enabled platform delivering 1.2 TBps bandwidth, backed by channel simulations across the SoC, interposer and Micron’s HBM3E memory,” added Mohit Gupta, Senior Vice President and General Manager, Custom Silicon and IP, Alphawave Semi. “Leveraging this, along with our leading-edge custom silicon and advanced 2.5D/3D packaging capabilities, allows Alphawave Semi to a provide a very significant time-to-market advantage to our hyperscaler and data center infrastructure customers for their AI-enabled systems.”