Memory

Offering improved performance and lower power consumption, a DDR4 overclocking memory has been released by ADATA. The XPG Z1 DDR4 DRAM module, which is part of the company's XPG series, supports the Intel Haswell-E platform. With an operating voltage of 1.2V, the module is kept at a low temperature, providing stable operation. Efficient data transfer is also enabled by the system's 2800MHz speed, 17-17-17 CL timings and 2...

3D Vertical NAND (V-NAND) flash memory is breaking through the current scaling limit for existing NAND flash technology. Achieving gains in performance and area ratio, the new 3D V-NAND is developed for a wide range of consumer electronics and enterprise applications, including embedded NAND storage and solid state drives (SSDs).

The rate at which modern devices generate data means it should come as no surprise that manufacturers are still actively developing alternative and - hopefully - improved non-volatile memory solutions. Philip Ling, Editor, ES Design magazine, takes a look at some of the most recent developments.

An overclocking DRAM series, which has a speed of 3100MHz and a bandwidth of 24.8GBps, has been introduced by ADATA. The XPG V3 series is based on the fourth and fifth generation Intel Core processors, and latest Z97 platform. The overclocking DRAM, which supports Extreme Memory Profile version 1.3, utilises Thermal Conductive Technology to reduce the system temperature.

To meet the demand for DRAM modules for the Intel Xeon processor E5-2600 v3 platform, IDT has shipped 1m DDR4 registers. These include the 4DB0124K data buffer, and TSE2004GB2 thermal sensor with SPD.

8Gb DDR3 components with a single chip-select, claimed to be the world's first, have been introduced by I'M Intelligent Memory. The JEDEC specification JESD79-3 has always allowed an 8Gb density for DDR3 memory devices. While most DRAM manufacturers are waiting for a 2 x nm process to fit such high memory capacity into a single DRAM IC package, I’M has manufactured 8Gb DDR3 components utilising existing 30nm manufacturing technolo...

Alliance Memory has introduced a new line of high-speed CMOS double data rate 3 synchronous DRAMs (DDR3 SDRAM) and low-voltage DDR3L SDRAMs with densities of 1 Gb, 2 Gb, and 4 Gb in 78-ball 9 mm by 10.5 mm by 1.2 mm and 96-ball 9 mm by 13 mm by 1.2 mm FBGA packages. With their double data rate architecture, the devices released today offer extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of 800 MHz.

Avalue Technology Inc. introduces two Mini ITX barebone PCs: BMX-T510 & BMX-T520 Series that offer competitive pricing in the market. BMX-T510 & BMX-T520 Series are targeted to meet demands for the embedded market, such as digital signage, SMB Storage Appliance & Surveillance, Gaming, Smart KIOSK, Industrial Control and Automation.

Uniquify announced immediate availability of its LPDDR4 memory IP, including the memory controller.

Uniquify announced that it has achieved an ultrafast DDR3 performance of 2100 megabits per second (Mbps) in a low-cost wire bond package.