Memory

Manufactured with the company’s high-performance SuperFlash technology, which is claimed to provide the industry’s fastest erase times, Microchip has released a family of 1.8V Serial Quad I/O (SQI) SuperFlash memory devices. The 16Mb SST26WF016B performs sector and block erase commands in 18ms and full chip erase operations in 35ms.

Cadence's Verification IP (VIP) supports all popular 3D memory standards, including Wide I/O 2, Hybrid Memory Cube (HMC), High Bandwidth Memory (HBM) and DDR4 3D Stacking (DDR4-3DS). The portfolio of memory VIP allows designers to accelerate the verification of memory interfaces and achieve earlier SoC verification closure for compute server applications, mobile devices, high-performance graphics and network applications.

To achieve a 10% reduction in total die size while maintaining product quality and performance, Marvell Semiconductor have utilised Synopsys' MMB (Multi-Memory Bus) processor for it's networking SoC. The processor, from Synopsys' DesignWare STAR Memory System, allowed Marvell to accelerate silicon bring-up and achieve silicon success.

Alliance Memory has partnered with Micron Semiconductor to supply and extend availability of support for three 512M synchronous DRAM (SDRAM) devices that Micron discontinued with Micron PCN #30995. Alliance Memory will be offering Micron's 32M x 16 MT48LC32M16A2P-75:C (commercial temperature), 32M x 16 MT48LC32M16A2P-75 IT:C (industrial temperature), and 64M x 8 MT48LC64M8A2P-75:C.

To reach the stringent low power requirements of LCD Drivers and Touch Screen Controllers, Dolphin Integration has launched a foundry sponsored Single port RAM for the UMC 110 nm embedded flash process.  Fabless companies targeting these applications have huge constraints both in terms of power consumption and area.

Toshiba Electronics Europe has launched what it claims to be the world’s smallest-class of embedded NAND flash memory products integrating NAND chips fabricated with cutting-edge 15nm process technology. The e-MMC NAND chips are designed for applications including smartphones, tablets and wearable devices.

Capable of generating the bus termination voltages needed by DDR 2, 3, 3L and 4 SDRAM memory systems, a low-dropout linear regulator has been released by Diodes Incorporated. The AP2303 regulator, which is suitable for next-gen set-top boxes, mother boards and graphics cards, continuously sources and sinks current up to 1.75A.

Expanding the 31 devices in its RX111 Group of 32-bit MCUs, Renesas has introduced versions with larger memory capacities for applications including healthcare devices, industrial equipment and building automation systems. The 15 enhanced MCUs offer flash memory capacity to 512KB and RAM capacity to 64KB.

Designed to increase efficiency and extend battery life in compact portable devices, a line of high-speed mobile CMOS DDR SDRAMs has been released by Alliance Memory. The AS4C16M16MD1, AS4C32M16MD1, AS4C16M32MD1, AS4C64M16MD1, AS4C32M32MD1 and AS4C64M32MD1 modules are available in 256Mb, 512Mb, 1Gb and 2Gb and feature low power consumption of 1.7-1.95V.

Integrated Device Technology has received OEM and memory supplier qualification for it's DDR4 chipset on enterprise servers designed with the Intel Xeon processor E5-2600 v3 family. By supporting the latest generation of DDR technologies, the DDR4 server memory interface chipsets enable faster data rates at higher densities on RDIMMs and Load-Reduced DIMMS (LRDIMMs) supported by the Intel Xeon product family.