Memory

EPFL scientists have developed a perovskite material with unique properties that can be used to build next-gen hard drives. As we generate more and more data, we need storage systems, e.g. hard drives, with higher density and efficiency. But this also requires materials whose magnetic properties can be quickly and easily manipulated in order to write and access data on them. EPFL scientists have now developed a perovskite material whose magn...

Conventional memories used in today’s computers only differentiate between the bit values 0 and 1. In quantum physics, however, arbitrary superpositions of these two states are possible. Most of the ideas for new quantum technology devices rely on this “Superposition Principle”. One of the main challenges in using such states is that they are usually short-lived. Only for a short period of time can information be read out of qua...

Consolidation solutions for multicore PCs from TenAsys have been extended with full access to available system memory and programming language support. Version 6.2 of the INtime real-time operating system enables memory extension technology providing each process access to 4GB of physical memory, regardless of the number of processes and cores used on any given system.

A 12 pin-count bus interface has been introduced by Macronix. This design keeps the high speed, high efficiency features of OctaFlash while using 12 pins, sharing the same data I/O, to enable simplicity in system design and optimises PCB space, resulting in cost savings and enhancing the performance.

  Electronic Specifier Editor Joe Bush spoke to Kris Baxter of Micron Semiconductor Products about the crucial role that security will play in the Industrial Internet of Things (IIoT).

Macronix International announced STMicroelectronics has adopted Macronix’ solution and used its Flash memory products in ST’s new STM32F767/769 microcontrollers Discovery Kit board with unique memory, graphics and communication peripherals. Macronix’s Quad-SPI Flash memory MX25L51245G provides high read bandwidth to enable faster access times in high-performance embedded systems.

Toshiba announced the outline schedule for the construction of a state-of-the-art fabrication facility at Yokkaichi Operations in Mie, Japan, for expanded production of BiCS FLASHTM, its proprietary 3D Flash memory. Following on from the March announcement of its intention to build a new BiCS FLASHTM facility, the company decided to start construction in February 2017. The new fab will be dedicated to 3D Flash memory processes.

  Microsemi announced two new adapters in its award-winning Microsemi Adaptec Series 8 product family. The 8405E and 8805E offer server storage customers entry-level systems with redundant array of independent disks (RAID) devices that deliver accelerated performance with built-in cache and uncompromised reliability.

Microchip announces the PIC18F “K40” family of microcontrollers (MCUs) consisting of 10 new devices ranging from 16-128 KB of Flash memory with package options covering 28-64 pins. These cost optimised 8-bit MCUs are the first PIC18 product family to offer Microchip’s popular Core Independent Peripherals (CIPs). CIPs provide developers with the ability to accomplish tasks in hardware whilst freeing-up the CPU to do other ta...

The HK4 series 6.0Gbit/s SATA SSD series is Toshiba’s first solid state drive SSD for enterprise and data centre applications to embed 15nm MLC NAND flash memory. The SSDs which are available at Rutronik offer low latency tuned for high quality of service (QoS) and are designed for read-intensive and value-endurance workloads.