Memory

The fourth industrial revolution is being fueled by data and machine learning, and is defined by the digital transformation of factories through the convergence of Information Technology (IT) and Operational Technology (OT) at scale. Dubbed ‘Industry 4.0’, it has already empowered many factories to become 'smarter' through real time monitoring, AI-driven decision making, autonomous manufacturing, and even predicting market demand.

Winbond Electronics has announced that its W75F, a Secure Flash memory device with Common Criteria EAL5+ certificate, has now achieved the ISO26262 ASIL Grade D safety certification. For automotive market, the W75F Secure Memory is compliant with the AEC-Q100 and is now officially certified ASIL-D.

KIOXIA Europe, the European-based subsidiary of KIOXIA Corporation, has announced the construction of a fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan to expand production of its proprietary 3D flash memory BiCS FLASHTM. The construction of KIOXIA Corporation’s Fab7 facility is expected to commence in the spring of 2021.

Swissbit has announced that it will showcase robust and durable flash memory solutions for industrial applications at electronica virtual 2020, from November 9th to 12th, 2020 under the headline ‘Endurance with 3D-NAND’ with its Embedded IoT Solutions division exhibiting hardware-based security solutions designed to protect data and devices in Internet of Things applications.

Synopsys has announced that its 3DIC Compiler solution enabled Samsung Foundry to design, implement and tape out a complex 5-nanometer SoC featuring eight high-bandwidth memories (HBMs) in a single package.

Apacer has released a robust DDR4 Rugged SODIMM anti-vibration memory module, which is targeted at defence and industry applications that suffer from high-vibration environments. It can help industrial vertical markets such as 5G base stations, energy exploration, wind power generation, aerospace defence, railways and transportation systems painlessly upgrade rugged applications to make them more robust.

Researchers at MINES ParisTech have implemented Panasas ActiveStor high-performance computing (HPC) data storage to support the rapidly growing research efforts at the university’s Materials Research Centre. MINES ParisTech, which conducts €30 million in annual research contracts, needed to expand its HPC data storage capacity to take on an increasing load of research to drive further discoveries.

SK hynix has announced the launch of its DDR5 DRAM, a high-speed and high-density product optimised for big data, Artificial Intelligence (AI), and machine learning (ML) as a next generation standard of DRAM.

X-FAB Silicon Foundries and with Attopsemi, have entered into a collaboration to satisfy the memory requirements of 5G technology. The companies have announced successful qualification of Attopsemi’s I-fuse OTP memory in relation to X-FAB’s XR013 open-platform foundry 130nm RF-SOI technology.

SMART Modular Technologies has announced its new BGAE440 family of eMMC (embedded MultiMediaCard) products under the brand name, DuraFlash. DuraFlash is SMART Modular’s designation for durable Flash memory solutions that are built to higher standards to deliver the durability and reliability expected in industrial embedded market segments.