Memory

Ramtron International has announced that Daesung-Eltec Co. Ltd. of Korea has designed FRAM memory into its new digital signal processing (DSP)-based car audio platform. Daesung-Eltec selected the FM24C64 - a 64-kilobit FRAM with 2-wire serial interface – to enable sophisticated memory functions such as storing audio, channel and favourite artist/song settings, as well as the resume play and the favourite artist/song alert features. FRAM’s n...

Addressing the performance, compatibility, functionality and reliability needs of solid state mass storage solutions, SST (Silicon Storage Technology) has announced that it is expanding its NAND controller offerings with two new NAND controllers, the ATA Flash Disk Controller (SST55VD020) and the CompactFlash Card Controller (SST55LC200). Featuring an advanced error correction code (ECC) engine, these high-performance controllers are well positio...

Intel Corporation, STMicroelectronics and Francisco Partners have unveiled the company name of “Numonyx” for the pending independent semiconductor company announced on May 22. Numonyx, being created from the key assets of businesses that last year generated approximately $3.6 billion in combined annual revenue, will focus on supplying non-volatile memory solutions for a variety of consumer and industrial devices including cellular phones, MP3...

SST (Silicon Storage Technology has announced that it is sampling the first in its All-in-OneMemory product family, the SST88VP1107. By blending the key benefits of NOR, NAND and RAM in a unified architecture, the first All-in-OneMemory product comes configured with 512 KByte instant-on boot NOR, 128 MByte execute-in-place (XIP) code storage, 120 MByte data storage and 12 MByte system RAM for mobile and embedded applications.

Toshiba has expanded its line of small-format, high-speed, high-capacity memory cards with the announcement of the launch of a 4-gigabyte microSDHC card. The addition of the new card extends Toshiba’s range of microSDHC cards, the preferred memory card for mobile phone applications, from 256MB up to 4GB.

Ramtron has expanded its line of FRAM Grade 1 automotive memory products with the qualification of an additional serial FRAM device to operate at +125 degrees Celsius (C). The FM25CL64-GA – a 3-volt, 64-kilobit (Kb) FRAM with a high-speed serial peripheral interface (SPI) – is now Grade 1 AEC-Q100 qualified, making it suitable for automotive applications under the hood, as well as many others in the passenger cab. In tandem with the product...

Ramtron has launched what it says is the semiconductor industry’s first non-volatile state saver – a device that saves the state of signals on demand and restores them to the correct state automatically upon power up. FRAM technology uniquely enables this capability due to its fast write time and virtually unlimited write endurance. Ramtron’s new family of low-power, non-volatile state savers currently has two products: the FM1105, which...

IDT (Integrated Device Technology, Inc.), has announced the third generation device in its Advanced Memory Buffer family, the Advanced Memory Buffer Plus (AMB+), which is said to offer the lowest power consumption available in the industry today - up to forty percent power savings over competitive AMB offerings. Compliant with the JEDEC AMB specifications, the IDT AMB+ device is an essential building block in Fully Buffered Dual In-line Memory Mo...

SST has unveiled its All-in-OneMemory solution, a revolutionary memory subsystem that blends key benefits of NOR, NAND, and RAM in a unified architecture which offers multi-gigabyte of execute-in-place (XIP) code storage and satisfies the growing data storage needs of embedded applications. All-in-OneMemory technology provides a completely-managed memory subsystem for a wide range of embedded system applications, including multimedia-enabled cell...

STMicroelectronics has announced that all of its Serial EEPROM devices, from 2 to 64-Kbit density – and from both the SPI and I2C interface series – are now available in the tiny 2 x 3mm MLP8 package, compared to the predecessor 4 x 5mm S08N package, enabling significant space and cost savings for portable consumer and communications products.