Memory

Microchip announced that its single-I/O bus UNI/O EEPROM devices are now available in miniature, Wafer-Level Chip-Scale and TO-92 packages, in addition to the 3-pin SOT-23 package. Measuring at 0.85 mm x 1.38 mm, the Wafer-Level Chip-Scale Package (WLCSP) is approximately the size of a die and supports a manufacturing flow using standard pick-and-place machines. The long-leaded, 3-pin TO-92 package is commonly used when the manufacturing flow...

Toshiba Electronics Europe (TEE) has further expanded its range of memory products with the launch of a new family of high-quality USB Flash drives and the commercial availability of 16GByte, Class 4-compliant microSDHC cards. The company has also announced that its high-speed professional range of SD cards is now certified in accordance with the new Class 10 SD Association standard.

ISSI's PowerSaver Mobile SDRAM range is now available from Nu Horizons. The range includes 32, 64, 128, 256 and 512Mbit mobile SDRAMs that offer lower voltage and power options than standard SDRAMs at high data rates. The PowerSaver range features low standby current with self-refresh options to maximise battery life and reduce heat in mobile device applications. 1.8, 2.5 and 3.3V options are available with industrial and commercial temperature r...

Innovative Silicon, Inc. (ISi), developer of the Z-RAM zero-capacitor, floating body (FB) memory technology, today announced two major breakthroughs to its Z-RAM technology. First, bit cell operating voltage has been reduced to below one volt (1V), making it the industry’s lowest-voltage FB memory bit cell and the first to be on-par with traditional DRAM voltages. Second, Z-RAM technology is now constructed on bulk silicon – without the req...

Ramtron announced today the issuance of U.S. Patent No. 7,672,151 entitled Method for Reading Non-volatile Ferroelectric Capacitor Memory Cell. The patent materially expands Ramtron’s intellectual property portfolio.

STMicroelectronics (NYSE: STM), a world leader in RF Memory and EEPROM ICs, has announced sample availability of the first in a new family of products that provide the flexibility to remotely program or update electronic products, anytime during their lifetime, and anywhere in the supply chain. The new devices enable manufacturers to update parameters, regionalize or activate software without connecting a programmer, or even opening the retail p...

APRO, Taiwan’s leading manufacturer of industrial-grade NAND Flash storage devices, has teamed with European Flash memory specialists, ProSaleTech and Phoenix Systems Engineering & Technologies (PST), in order to expand and strengthen its presence in the European market.

Toshiba Corporation has announced an expanded line-up of NAND-flash-based solid state drives based on the company’s 32nm Multi-Level- Cell NAND flash memories. The new drives include the industry's first 128-gigabyte Half-Slim /mSATA SG Series SSD modules, ideally suited for a variety of applications including mini-mobile and netbook PCs, and the HG Series that delivers all the high level performance and endurance essential for notebook compute...

Toshiba Corporation has announced the launch of a 64 gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry. The chip is the flagship device in a new line-up of six embedded NAND flash memory modules that offer full compliance with the latest e•MMC TM standard, and that are designed for application in a wide range of digital consumer products, including smartphones, mobile phones, netbooks and digital...

Macronix International continues its leadership and innovation in the Serial Flash market by announcing the world’s first 256-megabit(Mbit) Serial Flash product. This new 256Mbit product, MX25L25635E, will allow system designers and manufacturers to offer greater functionality and performance in their products.