Memory
Cypress Claims World's First 32-Mbit and 64-Mbit Fast Asynchronous SRAMs
Cypress Semiconductor just introduced 32-Mbit and 64-Mbit fast asynchronous SRAMs, the industry’s first such devices. The new SRAMs offer very fast response times and the smallest footprint at these densities. They target applications such as storage servers, switches and routers, testing equipment, high-end security systems and military systems.
Premier Farnell gets Flash with Spansion
Premier Farnell just announced a global franchise distribution agreement with Spansion, the leading Flash memory solutions provider. The announcement is in line with the company’s continuous drive to accelerate electronic design engineering growth and its internationalisation strategy. Premier Farnell and Spansion have extended an already successful US franchise agreement to provide electronic design engineers a broad portfolio of leading Flash...
Toshiba Announces Retail Availability of World’s Fastest SD Format Memory Card
Toshiba Electronics Europe (TEE) has announced that the first shipments of the world’s fastest SD format memory card to the retail channel will begin in May 2010 in Europe. The 64GByte SDXC (eXtra Capacity) product is ideal for use with Net PCs and offers high-speed read and write rates of up to 60Mbytes per second and 35Mbytes per second respectively.
ACAL Technology signs agreement with Swissbit for UK and France
ACAL Technology have signed a technical distribution agreement, covering the UK and France, with Europe’s largest independent DRAM module and Flash storage manufacturer, Swissbit. The agreement will give designers of embedded and industrial products, access to Swissbit’s rugged storage devices combined with ACAL Technology’s extensive expertise in the design and custom assembly of products for embedded and industrial environments.
Microchip Technology Expands UNI/O EEPROM Product Line With Wafer-Level Chip-Scale and TO-92 Packages
Microchip announced that its single-I/O bus UNI/O EEPROM devices are now available in miniature, Wafer-Level Chip-Scale and TO-92 packages, in addition to the 3-pin SOT-23 package. Measuring at 0.85 mm x 1.38 mm, the Wafer-Level Chip-Scale Package (WLCSP) is approximately the size of a die and supports a manufacturing flow using standard pick-and-place machines. The long-leaded, 3-pin TO-92 package is commonly used when the manufacturing flow...
Toshiba Announces New USB Flash Drives, Availability of Class 4 16GByte microSDHC cards and Class 10 Certification for SDHC products
Toshiba Electronics Europe (TEE) has further expanded its range of memory products with the launch of a new family of high-quality USB Flash drives and the commercial availability of 16GByte, Class 4-compliant microSDHC cards. The company has also announced that its high-speed professional range of SD cards is now certified in accordance with the new Class 10 SD Association standard.
Mobile SDRAM range from Nu Horizons offers lower voltage and power options
ISSI's PowerSaver Mobile SDRAM range is now available from Nu Horizons. The range includes 32, 64, 128, 256 and 512Mbit mobile SDRAMs that offer lower voltage and power options than standard SDRAMs at high data rates. The PowerSaver range features low standby current with self-refresh options to maximise battery life and reduce heat in mobile device applications. 1.8, 2.5 and 3.3V options are available with industrial and commercial temperature r...
Innovative Silicon’s Z-RAM Technology Meets Low Voltage and Bulk Silicon Requirements of DRAM Memory Manufacturers
Innovative Silicon, Inc. (ISi), developer of the Z-RAM zero-capacitor, floating body (FB) memory technology, today announced two major breakthroughs to its Z-RAM technology. First, bit cell operating voltage has been reduced to below one volt (1V), making it the industry’s lowest-voltage FB memory bit cell and the first to be on-par with traditional DRAM voltages. Second, Z-RAM technology is now constructed on bulk silicon – without the req...
Ramtron Granted Fundamental Ferroelectric RAM Patent
Ramtron announced today the issuance of U.S. Patent No. 7,672,151 entitled Method for Reading Non-volatile Ferroelectric Capacitor Memory Cell. The patent materially expands Ramtron’s intellectual property portfolio.
STMicroelectronics Launches New Dual-Interface EEPROM Enabling Remote Access to Electronic Device Parameters
STMicroelectronics (NYSE: STM), a world leader in RF Memory and EEPROM ICs, has announced sample availability of the first in a new family of products that provide the flexibility to remotely program or update electronic products, anytime during their lifetime, and anywhere in the supply chain. The new devices enable manufacturers to update parameters, regionalize or activate software without connecting a programmer, or even opening the retail p...