Memory

To provide customers with a more diverse product range, Apacer has revealed three models of the new-generation of modular SATA SSDs; the SDM4 MP (SATA Disk Module, Middle Profile), with 7-pin SATA connectors available in three orientations of 90°, 180° and 270°, along with a patented built-in power supply design. These are designed to meet user-specific needs for various form factors and industrial designs.

Micron Technology, Inc. today announced development of its first fully functional DDR4 DRAM module. The company has begun sampling and has received feedback from major customers to support quick implementation for applications in 2013.

Inphi Corporation today announced that load-reduced dual-inline memory modules (LRDIMMs) with Inphi’s Isolation Memory Buffer (iMB) technology are now available on HP ProLiant Generation 8 (Gen8) server systems based on the Intel Xeon Processor E5 family. Performance, memory capacity and cost efficiencies of Intel Xeon Processor E5 family-based servers designed for cloud, data center and enterprise applications now can be optimized through next...

Invensas Corporation today introduced its DIMM-IN-A-PACKAGE multi-die face-down (xFD)TM technology for thin and light notebooks, also known as UltrabooksTM, and tablet computers. Invensas’ novel solution delivers the memory capacity and performance of a small outline dual in-line memory module (SODIMM) in a miniature, soldered-down, ball grid array (BGA) package.

Micron Technology, Inc. today announced a new solid-state drive (SSD) that broadens Micron's client product portfolio to serve the rapidly emerging Ultrabook category. The newly announced drive is based on the proven architecture of Micron's popular RealSSD C400 drives, providing the same high performance and reliability.

Super Talent Technology today announces the new RAIDDrive upStream, a new type of SSD designed for the PCI backplane. SSD solutions were first introduced as 2.5” SATA replacements for existing Hard Drives. These transitive solutions have clearly demonstrated the benefits of SSD technology we know today.

ADATA Technology today launched a new line of DDR3L ECC SO-DIMM server memory modules, boasting low voltage, large densities, and rapid processing capability. They are designed and engineered especially for cloud computing solutions, and can greatly minimize the power consumption of a wide range of network systems.

TDK Corporation has developed the eSSD series, a single chip 3Gbps SSD with serial ATA interface that uses multi-chip technology to integrate the TDK SSD controller GBDriver RS3 with NAND type flash memory in a single package. Sales are scheduled to begin in April.

Super Talent Technolog today announces a new line of 1066 & 1333 MHz, quad-rank registered DDR3 RDIMM modules for servers. Many of today’s new servers support a new 16 core processors and now require a new type of RDIMMs called quad-channel DDR3. On the heels of their single and dual rank RDIMMs,

The new C-400 series CompactFlash card from Swissbit offers the highest possible level of reliability that is currently available for non-volatile memory. This is achieved through well designed wear leveling, read disturb management and the BCH-ECC (Bose-Chaudhuri-Hocquenghem-Codes) unit, which can correct up to 24 bits per 1024 bytes using a tried-and-tested procedure.