Memory

Texas Instruments today introduced the industry’s first high-temperature, nonvolatile Flash memory device for harsh environments. The SM28VLT32-HT has an operational capacity of 4 MB and eliminates the need for costly up-screening and qualification testing of industrial-grade components for temperature ranges outside data sheet specifications.

Crucial has today announced the immediate availability of Crucial Ballistix Low Profile memory, which delivers a true low profile design to provide more clearance around high-end CPU coolers and improve airflow throughout the system. Designed for performance enthusiasts and small form factor computer builders with limited space, Crucial Ballistix LP memory features all the performance benefits of Ballistix memory without the height concerns of ta...

TDK has developed the GBDriver RS4 series of NAND type flash memory controllers with support for 3 Gbps serial ATA. Sales will begin in January 2013. With an effective access speed of 180 MB/sec, the GBDriver RS4 is an advanced high-speed SATA controller chip.

X-FAB Silicon Foundries and Anvo-Systems Dresden today announced a cooperative agreement to offer high-speed non-volatile memory solutions that combine SRAM, DRAM and SONOS FLASH technologies; the compact design results in a small silicon footprint that keeps device costs low.

Fujitsu have unveiled a new addition to its wide voltage range Ferroelectric Random Access Memory product series (V series). The newly launched MB85RC256V offers the highest density level in the V series and is Fujitsu’s first FRAM product that operates in an even wider voltage range of 2.7 V to 5.5 V, which provides even greater flexibility for customer applications.

Super Talent have introduced new DDR3 Mini-RDIMM, VLP RDIMM, and VLP ECC UDIMM modules designed for industrial, embedded, and sever systems. These new memory modules all feature low operating voltages and a small form factor while delivering impressive 1600MHz (PC3-12800) speeds in up to 8GB densities.

Kilopass Technology today announced Gusto-2, its second generation of code storage products, to serve the increasing numbers of new system-on-chip designs for instant-on mobile devices. The targeted SoCs perform functions, such as digital monitoring, near-field communications, and other applications serving the emerging market of Internet of things.

SK Hynix announced that it has developed the industry’s first 20nm class 4Gb graphics DDR3 DRAM which provides power efficiency and fast speed performance. As an eco-friendly product, it is well suited for the low power laptop since it operates at a low-voltage while it offers graphics performance as the desktop level.

Cadence has announced that it will showcase the company’s expertise in memory design IP at MemCon 2012. Martin Lund, senior vice president of research and development, SoC Realization Group at Cadence, kicks off MemCon 2012 with his keynote speech, “How Cloud and Mobility are Disrupting the Memory Ecosystem” on Tuesday, September 18, from 9:30-10:00 AM.

Micron have today announced high-volume availability of 30-nanometer reduced-power DDR3L-RS SDRAM for ultrathin computing devices and tablets. The 2-gigabit and 4Gb solutions reduce power consumption in standby to provide longer battery life, while maintaining the high performance and cost effectiveness of PC DRAM.