IoT

NeoCortec, the experts on wireless connectivity and providers of ultra-low-power bi-directional wireless mesh network hardware and software solutions, are showcasing a new demo on their stand (Hall 3 Stand 526) and in two of the exhibition halls.

The education programme for Smart Manufacturing and Engineering Week has been announced with nearly 150 free-to-attend sessions taking place across eight solutions theatres during the live events on 5–6 June 2024 at Birmingham’s NEC. 

Nordic Semiconductor showed a number of new solutions – including its “Thingy:91 X”, which in addition to cellular IoT now adds support for DECT NR+, Wi-Fi locationing, and fuel gauging – at embedded world 2024.

Powercast Corporation, the industry’s one-stop-shop for wireless power, has launched its Extended-Temperature RAIN RFID Reader Module designed to integrate into high-temperature RFID readers that need to reliably operate in the extreme conditions present in automotive, industrial, outdoor, energy, and other applications.

ADLINK Technology, a global specialist in Edge computing, is proud to launch its latest innovation, the EMU-200 series, an application-ready IIoT gateway that can meet the data network requirements of various harsh application scenarios, including renewable energy, electric vehicle (EV) charging, building management, and factory equipment monitoring.

Silicon Labs, a specialist in secure, intelligent wireless technology for a more connected world, has announced their new xG26 family of Wireless SoCs and MCUs.

Qt Group and Qualcomm Technologies are collaborating to streamline development of advanced graphical user interfaces (GUI) and software quality assurance for industrial IoT devices.

Kontron, a global provider of IoT/Embedded Computer Technology (ECT), is introducing three product lines based on the next generation of Intel Atom processors, becoming available in the forthcoming months: COM Express Compact Type 6 with COMe-cAS6, COM Express Mini Type 10 with COMe-mAS10, and SMARC module with SMARC-sXAS.

SECO, a pioneer in industrial digitalisation technologies, has announced the launch of its latest COM Express module, incorporating the newly introduced Intel Atom Processors x7000RE Series (Codename: Amston Lake).

Silicon Labs has announced its new xG26 family of Wireless SoCs and MCUs for IoT applications.