Qorvo extends RF multi-chip module leadership

These new modules utilise Qorvo’s advanced packaging and optimised process technology to offer the compact size, performance, lower noise, and reduced power consumption required for modern phased array and multifunction radar systems.

Doug Bostrom, General Manager of Qorvo's Defence and Aerospace business, said: “These new multi-chip modules combine several functions into one package, reducing board area, boosting performance and streamlining both design and assembly for our customers. This approach underscores our commitment to innovation and customer success by helping accelerate their time-to-market. Complemented by our recent acquisition of Anokiwave and associated beamformer technology, Qorvo is well positioned to provide complete solutions for phased array radar applications."

Key features and benefits:

• QPF5001 12W X-band front-end module (FEM): combines a power amplifier, low noise amplifier (LNA), and limiter in one compact module, reducing the board area by approximately 50% compared to discrete component solutions
• QPM2101 S-band Receive variable gain amplifier (VGA) MCM: integrates an LNA, 6-bit digital step attenuator, Rx buffer and T/R switch, delivering a 40% reduction in board area
• QPB1029 L-band filter bank MCM: integrates two switches on both sides of eight filters and a bypass. Housed in a 10 x 10mm package, it is the industry’s smallest L-band radar eight-channel switched filter bank, enabling radar designers to achieve size, weight, power and cost (SWaP-C) goals

Connect with Qorvo at IMS 2024 Booth 1125, June 16-21, in Washington, D.C.