Applications that quickly and accurately locate people and items drive significant growth in positioning technologies. A 2024 Gartner report projects the indoor location services market will reach $55 billion by 2030, up from $1.9 billion in 2021.

Qorvo has introduced a new system on chip (SoC) solution for smart home devices, which is now sampling with key customers.

Qorvo has announced the release of three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications.

Qorvo has announced the release of three new MMIC power amplifiers specifically designed for Ku-Band satellite communications terminals.

Qorvo announced the industry's first 4 milliohm silicon carbide (SiC) junction field-effect transistor (JFET) in a TOLL package.

Paige West speaks with Mike Engelhardt, Creator, QSPICE, Qorvo about the next generation of SPICE.

Qorvo has announced the release of QSPICE, a new generation of circuit simulation software that provides power and analog designers with significantly higher levels of design productivity through improved simulation speed, functionality, and reliability.

Qorvo will showcase a new surface-mount TO-leadless (TOLL) package for its high-performance, 5.4mΩ 750V SiC FETs.

At embedded world 2023, Steven Magee, Software Engineer - PAC Motor Control ICs at Qorvo talks to and demonstrates to Electronic Specifier's Editor Mick Elliott about Qorvo's two new battery management systems.

At embedded world 2023, Brian McCarthy, Senior Product Line Manager for Power Applications Control at Qorvo talks to Electronic Specifier's Editor Mick Elliott about Qorvo's diversified growth with their new products in the power management front.

Qorvo has announced it has expanded its power management portfolio to include the PAC22140 and PAC25140 Power Application Controller (PAC) devices.

Mike Zhu, Applications Engineer at Qorvo examines designing PCBs for SiC FETs.

Adeia has announced that Qorvo has licensed Adeia’s hybrid bonding technology.

Paige West speaks with John Anderton, Director Product Line Management, Qorvo about how to start designing with Matter.

UnitedSiC, now Qorvo, has announced seven 750V silicon carbide (SiC) FETs in the surface mount D2PAK-7L package.

At PCIM Europe, Qorvo has announced a next-generation series of 1200V Silicon Carbide (SiC) Field Effect Transistors (FETs) with figures of merit in on-resistance.

There is a wide choice of topologies to use for the front-end of a three-phase EV battery charger. Jonathan Dodge, Senior Applications Engineer, UnitedSiC (now Qorvo) describes and compares some of the options and gives comparative efficiencies for an example case.

Here, Cees Links, General Manager of the Wireless Connectivity Business Unit at Qorvo, shares his insights on IoT standards and the future of IoT.  Quite regularly I get the question: with all these standards around, what should I choose? Zigbee, Thread, Bluetooth Mesh, or WiFi? Or maybe LoRa? Or is it better to wait for 5G and NB-IoT?

What is the future direction of connectivity? By now everyone is familiar with the range of issues – and range issues – that happen with your home WiFi, just as everyone is used to hearing grand promises made by the oncoming storm of 5G; but how much of a part will WiFi have left to play? Electronic Specifier caught up with Cees Links, GM at Qorvo, who shared his thoughts on the future of connectivity.

Every time a new cellular phone standard comes out, we see new claims about the “end of WiFi.” When 3G was announced, the promise was that it would make WiFi (802.11b) redundant, which clearly turned out to be incorrect. With 4G (LTE), this story repeated itself and claimed it would put WiFi (802.11ac) in the shredder. And now the 5G message is that it will cover both the inside and outside of homes and buildings. It’s almost as...