The Qorvo QPQ5501 is an high-performance, high power, Bulk Acoustic Wave (BAW) band-pass filter with extremely steep skirts, simultaneously exhibiting low loss in the Wi-Fi UNII 2c-4 band and high near-in rejection in the UNII 1-3 and UNII 5-8 band.

At embedded world 2025, on the DigiKey booth, Caitlin Gittins speaks with Ryan Scott, Marketing and Business Development for Motor Control and Drive Applications at Qorvo about Qorvo's ACT72350.

Qorvo, a global provider of connectivity and power solutions, has today added a highly-integrated brushless DC (BLDC) motor driver to its growing family of power management products.

Qorvo has announced a key new addition to its award-winning QSPICE circuit simulation software. Electronic designers can now create models for semiconductor components accurately, and in minutes instead of hours, using a new tool included with the free QSPICE software package.

Qorvo’s QSPICE Simulator and Model Generator has been shortlisted for the Electronics Excellence Awards under the Software Product category.

Applications that quickly and accurately locate people and items drive significant growth in positioning technologies. A 2024 Gartner report projects the indoor location services market will reach $55 billion by 2030, up from $1.9 billion in 2021.

Qorvo has introduced a new system on chip (SoC) solution for smart home devices, which is now sampling with key customers.

Qorvo has announced the release of three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications.

Qorvo has announced the release of three new MMIC power amplifiers specifically designed for Ku-Band satellite communications terminals.

Qorvo announced the industry's first 4 milliohm silicon carbide (SiC) junction field-effect transistor (JFET) in a TOLL package.

Paige West speaks with Mike Engelhardt, Creator, QSPICE, Qorvo about the next generation of SPICE.

Qorvo has announced the release of QSPICE, a new generation of circuit simulation software that provides power and analog designers with significantly higher levels of design productivity through improved simulation speed, functionality, and reliability.

Qorvo will showcase a new surface-mount TO-leadless (TOLL) package for its high-performance, 5.4mΩ 750V SiC FETs.

At embedded world 2023, Steven Magee, Software Engineer - PAC Motor Control ICs at Qorvo talks to and demonstrates to Electronic Specifier's Editor Mick Elliott about Qorvo's two new battery management systems.

At embedded world 2023, Brian McCarthy, Senior Product Line Manager for Power Applications Control at Qorvo talks to Electronic Specifier's Editor Mick Elliott about Qorvo's diversified growth with their new products in the power management front.

Qorvo has announced it has expanded its power management portfolio to include the PAC22140 and PAC25140 Power Application Controller (PAC) devices.

Mike Zhu, Applications Engineer at Qorvo examines designing PCBs for SiC FETs.

Adeia has announced that Qorvo has licensed Adeia’s hybrid bonding technology.

Paige West speaks with John Anderton, Director Product Line Management, Qorvo about how to start designing with Matter.

UnitedSiC, now Qorvo, has announced seven 750V silicon carbide (SiC) FETs in the surface mount D2PAK-7L package.