FPGAs
Microsemi Broadens FPGA Product Portfolio with Highly-integrated IGLOO2
Microsemi unveiled its IGLOO2 field programmable gate array family for industrial, commercial aviation, defense, communications and security applications. The non-volatile flash-based IGLOO2 FPGAs have the highest number of mainstream FPGA features including general purpose input/outputs, 5G SERDES interfaces, and PCI Express endpoints of any similar device on the market today, and feature the industry’s only high-performance memory subsystem.
Xilinx and TSMC Team to Enable Fastest Time-to-Market and Highest Performance FPGAs on TSMC's 16-nanometer FinFET
Xilinx and TSMC announced that they are teaming together to create the fastest time-to-market and highest performance FPGAs to be built on TSMC's 16-nanometer FinFET process, a program Xilinx calls 'FinFast.'
Compatible All-Programmable SoMs featuring Xilinx Artix, Kintex, and Zynq
Trenz Electronic presents its new series of FPGA and SoC modules. They are based on the latest Xilinx all-programmable devices (Artix, Kintex, and Zynq-7000) and are available in a uniform 4×5 cm form factor.
Lattice Announces World’s Smallest FPGA For Miniature Systems
Lattice Semiconductor unveil the iCE40 LP384 FPGA, the smallest member of its expanding iCE40 family of ultra-low density FPGAs. Enabling designers to rapidly add new features and differentiate cost-sensitive, space-constrained, low-power products, the new small footprint FPGA is ideal for applications such as portable medical monitors, smartphones, digital cameras, eReaders, and compact embedded systems.
Achronix Ship 22nm Speedster22i HD1000 FPGAs To Customers
Achronix is shipping the industry-leading Speedster22i HD1000 FPGA to customers. Built on Intel’s advanced 22nm, 3-D Tri-Gate transistor technology, Speedster22i HD devices consume half the power and are half the cost of competitive high-end FPGAs for targeted high bandwidth applications. They are the only FPGAs with a full suite of hardened interface IP including 10/40/100G Ethernet, 100Gbps Interlaken, PCI Express Gen1/2/3 and 2.133 Gbps ...
FTDI Adds Low Pin-Count, UART-to-USB Bridge to X-Chip Series
Future Technology Devices International Limited has further expanded its X-Chip series of feature-rich USB-to-serial interface chips with the introduction of the ultra-compact FT234XD. Contained in a 3mm x 3mm 12-pin DFN package that is optimised for smaller PCB designs, this highly integrated UART interface IC allows asynchronous serial data transfer - supporting data transfer rates from 300 bits/s to 3 Mbits/s.
Diodes Incorporated Expands General-Purpose Low-Voltage CMOS Logic Family
Continuing the rapid expansion of its standard logic product line, Diodes Incorporated has announced the availability of more package options added to its four families of high-speed and advanced high-speed CMOS parts. Provided in a choice of SO14 and TSSOP14 packages, the HC, HCT, AHC and AHCT logic families each offer 10 of the most popular logic functions in quad and hex configurations.
Microsemi applies Extended Flow to RT ProASIC3 FPGA Product Family
Microsemi today introduced the addition of the Extended Flow to its RT ProASIC3 field programmable gate array (FPGA) device family, providing additional screening options and a higher level of reliability assurance required in many critical space applications.
EBV Elektronik Presents Five New EBVchips
EBV Elektronik is introducing five exciting new semiconductor devices. The new devices, named Driver, Hermes, Hunter, SolexDrive and vTaric are each suited for dedicated applications in motion control, metering communications, isolated current measurement for FPGAs, solenoid actuation and automotive alternator regulation.
Microsemi release M2S050T SmartFusion2 system-on-chip FPGA family
Microsemi has today announced the release of the new SmartFusion2 system-on-chip field programmable gate array family. Microsemi’s next-generation SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical industrial, defence, aviation, communications and medical applications.