FPGAs

Lattice Semiconductor announced that its MachXO3 FPGA and USB 3.0 sensor bridge reference design are integrated in a USB 3.0 camera module from Leopard Imaging. The MachXO3 FPGA and the USB 3.0 sensor bridge reference design work together to convert the subLVDS video signal from the image sensor used in the module to a parallel format that can interface with the camera’s USB 3.0 controller.

Enabled by the latest Diamond 3.6 design tool suite software update, Lattice Semiconductor's MachXO3 FPGAs support 900Mb/s per lane operation for MIPI D-PHY interfaces. The MachXO3 devices can now be used to bridge a wide variety of image sensors & displays with MIPI D-PHY, CSI-2 or DSI interfaces at speeds of up to 900Mb/s.

Microsemi Corporation and The Athena Group have announced a comprehensive portfolio of IP cores with state-of-the-art Side Channel Analysis (SCA) and Differential Power Analysis (DPA) countermeasures. The recent portfolio, based on Athena's TeraFire cryptographic microprocessor family, is designed for users of Microsemi's SmartFusion2 SoC FPGAs and IGLOO2 FPGAs.

Altera and Intrinsic-ID have announced a collaboration on the integration of advanced security solutions into Altera’s Stratix 10 FPGAs and SoCs. Physical Unclonable Function (PUF)-based key storage is a requirement for many defence and infrastructure applications today to secure and bind software to hardware functions and prevent the cloning of systems.

The DMN3027LFG 30V N-channel MOSFET introduced by Diodes Incorporated is designed as a switch to rapidly and safely discharge large bulk capacitors used on FPGA power rails. The latest FPGAs found in telecomms, servers and data centres have multiple power rails that need to be correctly sequenced to safely power these systems up and down.

  “In 2013, U.S. data centres consumed an estimated 91bn kilowatt-hours of electricity - enough electricity to power all the households in New York City twice over - and are on-track to reach 140bn kilowatt-hours by 2020.” – National Resources Defense Council Report.

Microsemi and HMS Industrial Networks have announced the availability of HMS’s Anybus CompactCom 40-series products for industrial Ethernet solutions based on Microsemi’s SmartFusion 2 SoC FPGA. The highly secure device offers customers lower total cost of ownership and accelerated time-to-market with low power and secure industrial Ethernet protocol conversion solutions on a single SmartFusion2 FPGA platform.

Flex Logix has announced the extension of its core FPGA logic architecture to include Block RAM (BRAM) and DSP cores. Both BRAM and DSP are popular extensions found in traditional stand-alone FPGA products. The addition of low-latency memory and signal processing capabilities significantly increases the range of applications addressed by the company’s EFLX embedded FPGA-in-SoC architecture.

To encourage the use of its easy-to-implement next gen USB interfacing technology, FTDI Chip has unveiled a family of evaluation/development modules. The company’s FT600/1Q USB 3.0 SuperSpeed ICs, which are already in full volume production, are backed up by the UMFT60XX offering. This module family is made of 4 models, which provide different FIFO bus interfaces and data bit widths.

Reducing development risk and accelerating time-to-market, the ECP5 Versa development kit has been introduced by Lattice Semiconductor. The kit accelerates the prototyping and testing of connectivity designs targeted for small cells, microserver, broadband access and industrial video applications worldwide.