University of Texas at Austin Adds Plasma-Therm VERSALINE DSE Tool to Research Facility

Precise etching and process latitude are key elements to operate successfully in a research center environment. The award-winning deep silicon etch technology that the VERSALINE DSE provides, achieves these objectives through a combination of fast process control features and multi-step process flexibility.

Fast process control features such as patented pressure control algorithms, close mounted rapid gas switching, solid state matching networks and sensitive endpoint detection software, are joined with unmatched silicon-on-insulator (SOI) performance to deliver required high quality etchfeatures.

“We were extremely pleased with Plasma-Therm in terms of their installation of the DSE system and the training they provided. The tool is working as advertised,” stated Dr. Sanjay Banerjee, Director of the MRC at the University of Texas at Austin.

“Understanding our customer’s priorities and what makes them successful is a primary focus at Plasma-Therm. We realize that capital equipment is a significant portion of R&D programs and in turn we work to bring maximum value through high flexibility with all Plasma-Therm systems. Because of this, research and development in material science, optics, MEMS and microelectronics have relied on our equipment for generations,” stated Ed Ostan, executive vice president of sales & marketing at Plasma-Therm.

The University of Texas at Austin Microelectronics Research Center (MRC), funded by the National Science Foundation (NSF) through theNational Nanotechnology Infrastructure Network (NNIN), is a state-of-the-art, shared-equipment, open-use facility. The laboratory serves academic, industrial andgovernmental researchers across the country and around the world.MRC’s lab-members come from a wide variety of disciplines, with research in areas of electronics, optics, MEMS, biology and chemistry, as well as process characterization and fabrication of more traditional electronic devices.