Underfill Epoxy offers high glass transition temperature and low viscosity

This optically clear compound features high dimensional stability due to its nano-silica filler material. It has been successfully tested for abrasion resistance per ASTM D4060-14 and readily withstands 1,000 hours at 85°C and 85% relative humidity.

EP114 has excellent electrical insulation properties with a volume resistivity greater than 1,014 ohm-cm and a dielectric constant of 3.35 (60Hz) at 25°C. This system features an exceptionally low coefficient of thermal expansion of 20-22 x 10-6 in/in/°C along with a compressive strength of 24,000–26,000 psi, an ultra-high modulus of more than 1,000,000 psi and a hardness of 85–95 Shore D at 25°C. Also, it has a glass transition temperature of more than 200°C.

EP114 features excellent flow properties with a mixed viscosity of 500–1,500 cps. It offers a long working life after mixing, for example a 100-gram batch at 25°C will yield an open time of two to four days. The system requires heat for curing. One of the many recommended cure schedules is two to three hours at 125°C followed by five–eight hours at 150°C, with a two hour or longer post cure at 150–200°C. It is available in various packaging options: syringe kits, 1/2-pint kits, pint kits, and quart kits. It can also be packaged in pre-mixed and frozen syringes, which require storage at –40°C and are suitable for automated dispensing.

Master bond epoxies for underfill applications

Master Bond's underfill epoxies excel in three key areas: creating a strong connection between the underfill and die passivation layer, adhering exceptionally well to various materials, and enhancing mechanical support for your design. Additionally, they offer superior moisture protection.